公开(公告)号：US20180182506A1

公开(公告)日：2018-06-28

申请号：US15736013

申请日：2016-06-15

Applicant: BASF SE

Inventor： Xuerong GAO ,  Szilard CSIHONY ,  Markus FIESS ,  Marco CZINK

IPC: H01B1/22 ,  H01L31/0224 ,  H01L31/0216

CPC classification number: H01B1/22 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/022433 ,  H05K1/095 ,  H05K3/1216 ,  H05K2201/10143 ,  H05K2203/122 ,  Y02E10/50

Abstract: The invention relates to a conductive paste, comprising from 50 to 97 wt % of electrically conductive particles, 3 to 50 wt % of an organic medium and 0 to 20 wt % of a glass frit, the organic medium comprising a solvent, wherein the organic medium additionally comprises 10 to 90 wt % of a hydrocarbon-based lubricating oil and 2 to 60 wt % of a polymeric component, each based on the total amount of the organic medium, the polymeric component having a solubility of at least 100 g/kg in the lubricating oil. The invention further relates to a semiconductor device comprising a semiconductor substrate with at least one surface onto which an electrically conductive pattern is printed by using the paste.

公开(公告)号：US20190051774A1

公开(公告)日：2019-02-14

申请号：US16078176

申请日：2017-02-23

Applicant: BASF SE

Inventor： Markus FIESS ,  Han Chang PAN ,  Yu Lin WANG ,  Chia Chin CHO

IPC: H01L31/0224 ,  H01B1/22 ,  H01B1/24 ,  C03C4/14 ,  C03C8/18

CPC classification number: H01L31/022425 ,  C03C4/14 ,  C03C8/18 ,  C03C2204/00 ,  C03C2205/00 ,  H01B1/02 ,  H01B1/22 ,  H01B1/24 ,  H01L21/705 ,  Y02E10/50

Abstract: The invention relates to a conductive paste comprising from 30 to 97% by weight of electrically conductive particles, from 0 to 20% by weight of a glass fit, from 3 to 70% by weight of an organic medium and from 0.1 to 67% by weight of a silicone oil, each based on the total mass of the paste, wherein the silicone oil hasa boiling pointor a boiling rangein the range between 180° C. and 350° C. The invention further relates to a use of the conductive paste and a process for producing electrodes on a semiconductor substrate using the paste.