公开(公告)号：US20230128646A1

公开(公告)日：2023-04-27

申请号：US17905068

申请日：2021-02-25

Applicant: BASF SE

Inventor： Sebastian WAGNER ,  Mathias FEIL

IPC: C08K13/04 ,  C08L77/02 ,  C08L77/06 ,  C08J3/20

Abstract: Disclosed herein is a thermoplastic molding composition, including: a) 30 to 99.85 wt % of at least one thermoplastic polyamide as component A; b) 0.1 to 10 wt % of at least one polyhydric alcohol having more than 6 hydroxyl groups, and having a number average molecular weight Mn of more than 2000 g/mol as component B; c) 0.05 to 3 wt % of at least one sterically hindered phenol antioxidant as component C; d) 0 to 3 wt % of at least one polycarboxylic compound having more than 3 carboxylic acid groups and/or carboxylate groups, and having a number average molecular weight Mn of more than 300 g/mol as component D; e) 0 to 50 wt % of at least one fibrous and/or particulate filler as component E; and f) 0 to 25 wt % of further additives as component F; where the total of wt % of components A to F is 100 wt %.