HEAT-AGING RESISTANT POLYAMIDE MOLDING COMPOSITIONS

    公开(公告)号:US20230129664A1

    公开(公告)日:2023-04-27

    申请号:US17906925

    申请日:2021-03-23

    Applicant: BASF SE

    Abstract: Described herein is a thermoplastic molding composition, including 30 to 99.8 wt % of at least one thermoplastic polyamide as component A; 0.001 to 5 wt % of at least one polyethylenimine homo-or copolymer as component B; 0.1 to 2.0 wt % of at least one condensation product of secondary aryl amines and aliphatic aldehydes, aliphatic ketones, or mixtures thereof, or a combination of at least one secondary aryl amine and the at least one condensation product as component C; 0 to 3 wt % of at least one lubricant as component D; 0 to 50 wt % of at least one fibrous and/or particulate filler as component E; and 0 to 25 wt % of further additives as component F, where a total of wt % of components A to F is 100 wt %, which is free from copper.

    FLAME-RETARDANT POLYESTERS
    3.
    发明申请
    FLAME-RETARDANT POLYESTERS 审中-公开
    阻燃聚酯

    公开(公告)号:US20160200911A1

    公开(公告)日:2016-07-14

    申请号:US14917039

    申请日:2015-12-03

    Applicant: BASF SE

    Abstract: Thermoplastic molding compositions comprising A) from 10 to 98% by weight of a thermoplastic polyester B) from 0.5 to 30% by weight of a dicarboxylic salt of the formula where R1 to R4 are mutually independently halogen or hydrogen, with the proviso that at least one moiety R1 to R4 is halogen, x=from 1 to 3 m=from 1 to 9 n=from 2 to 3 M=alkaline earth metal, Ni, Ce, Fe, In, Ga, Al, Pb, Y, Zn, Hg C) from 1 to 30% by weight of a flame retardant combination made of C1) a halogen-containing flame retardant differing from B) C2) an antimony oxide D) from 0 to 50% by weight of other additives, where the total of the percentages by weight of components A) to D) is 100%.

    Abstract translation: 热塑性模塑组合物,其包含A)10至98重量%的热塑性聚酯B)0.5至30重量%的下式的二羧酸盐,其中R 1至R 4相互独立地为卤素或氢,条件是至少 一个部分R 1至R 4为卤素,x = 1至3m = 1至9 n = 2至3 M =碱土金属,Ni,Ce,Fe,In,Ga,Al,Pb,Y,Zn, Hg C)1至30重量%的由C1组成的阻燃剂组合物,不同于B)的含卤阻燃剂C2)氧化锑D)0至50重量%的其它添加剂,其中总计 组分A)至D)的重量百分比为100%。

    HEAT-AGING RESISTANT POLYAMIDE MOLDING COMPOSITIONS

    公开(公告)号:US20230128646A1

    公开(公告)日:2023-04-27

    申请号:US17905068

    申请日:2021-02-25

    Applicant: BASF SE

    Abstract: Disclosed herein is a thermoplastic molding composition, including: a) 30 to 99.85 wt % of at least one thermoplastic polyamide as component A; b) 0.1 to 10 wt % of at least one polyhydric alcohol having more than 6 hydroxyl groups, and having a number average molecular weight Mn of more than 2000 g/mol as component B; c) 0.05 to 3 wt % of at least one sterically hindered phenol antioxidant as component C; d) 0 to 3 wt % of at least one polycarboxylic compound having more than 3 carboxylic acid groups and/or carboxylate groups, and having a number average molecular weight Mn of more than 300 g/mol as component D; e) 0 to 50 wt % of at least one fibrous and/or particulate filler as component E; and f) 0 to 25 wt % of further additives as component F; where the total of wt % of components A to F is 100 wt %.

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