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    GENE SEQUENCING CHIP AND GENE SEQUENCING METHOD
    3.
    发明申请
    GENE SEQUENCING CHIP AND GENE SEQUENCING METHOD 有权

    公开(公告)号：US20210197163A1

    公开(公告)日：2021-07-01

    申请号：US16071932

    申请日：2018-01-02

    申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

    发明人： Yue GENG ,  Fengchun PANG ,  Peizhi CAI ,  Le GU

    IPC分类号： B01J19/00 ,  C12Q1/6874

    摘要： A gene sequencing chip is provided, which includes: an upper substrate including a plurality of liquid inlets for inletting liquid drops; a lower substrate opposite to the upper substrate and spaced therefrom by a gap, the gap being provided for allowing the liquid drops to move therein, the lower substrate including a liquid drop operation region, the liquid drop operation region including a manipulation electrode array. The manipulation electrode array includes multiple first sub-arrays for preparing a gene library, multiple second sub-arrays for sequencing the gene library which is prepared, each first sub-array being adjacent to one of the multiple second sub-arrays. Based on the gene sequencing chip provided in this disclosure, operations to tiny liquid drops such as movement, fusion and splitting can be accurately manipulated by using digital microfluidic techniques, and all steps of the gene sequencing from library preparation to gene sequencing can be completed on one chip.

    GENE SEQUENCING STRUCTURE, GENE SEQUENCING CHIP, GENE SEQUENCING SYSTEM AND GENE SEQUENCING METHOD
    5.
    发明申请
    GENE SEQUENCING STRUCTURE, GENE SEQUENCING CHIP, GENE SEQUENCING SYSTEM AND GENE SEQUENCING METHOD 审中-公开

    公开(公告)号：US20200299765A1

    公开(公告)日：2020-09-24

    申请号：US16084670

    申请日：2018-02-11

    申请人： BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

    发明人： Peizhi CAI ,  Fengchun PANG ,  Huazhe LIU

    IPC分类号： C12Q1/6874

    摘要： The present disclosure relates to a gene sequencing structure, chip, system, and method. The gene sequencing structure includes: a first electrode and a second electrode spaced apart from each other, a semiconductor layer, a sensing electrode, an insulating layer, and a sensitive film layer. The first electrode is connected to the second electrode via the semiconductor layer, the sensing electrode is in contact with the sensitive film layer, and the insulating layer isolates each of the sensitive film layer and the sensing electrode from each of the first electrode, the second electrode, and the semiconductor layer, wherein the sensitive film layer generates charges in response to receiving ions generated by base pairing during gene sequencing.

    GENE SEQUENCING CHIP, DEVICE AND METHOD
    6.
    发明申请
    GENE SEQUENCING CHIP, DEVICE AND METHOD 审中-公开

    公开(公告)号：US20190256902A1

    公开(公告)日：2019-08-22

    申请号：US15776224

    申请日：2017-10-24

    申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

    发明人： Peizhi CAI ,  Fengchun PANG

    IPC分类号： C12Q1/6869 ,  G02F1/1335 ,  G02F1/1339 ,  G01J4/04

    摘要： A gene sequencing chip, a gene sequencing device and a gene sequencing method are provided. The gene sequencing chip includes a first substrate, a common electrode, a second substrate and a liquid crystal layer. The first substrate is opposite to the second substrate, the liquid crystal layer is disposed between the first substrate and the second substrate. A side of the second substrate away from the first substrate includes at least one groove hollowed in the second substrate, the at least one groove is configured to contain a sample to be test, a bottom of the at least one groove close to the first substrate is provided with an ion sensitive film, the ion sensitive film is configured to sense an ion generated by a gene sequencing reaction within the groove to generate a voltage and generate an electric field with the common electrode.

    GENE SEQUENCING CHIP AND GENE SEQUENCING METHOD
    9.
    发明申请
    GENE SEQUENCING CHIP AND GENE SEQUENCING METHOD 有权

    公开(公告)号：US20220184577A1

    公开(公告)日：2022-06-16

    申请号：US17683059

    申请日：2022-02-28

    申请人： BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

    发明人： Yue GENG ,  Fengchun PANG ,  Peizhi CAI ,  Le GU

    IPC分类号： B01J19/00 ,  C12Q1/6874

    摘要： A gene sequencing chip is provided, which includes: an upper substrate including a plurality of liquid inlets for inletting liquid drops; a lower substrate opposite to the upper substrate and spaced therefrom by a gap, the gap being provided for allowing the liquid drops to move therein, the lower substrate including a liquid drop operation region, the liquid drop operation region including a manipulation electrode array. The manipulation electrode array includes multiple first manipulation electrode array for preparing a gene library, multiple second manipulation electrode array for sequencing the gene library which is prepared, each first sub-array being adjacent to one of the multiple second manipulation electrode array. Based on the gene sequencing chip provided in this disclosure, operations to tiny liquid drops such as movement, fusion and splitting can be accurately manipulated by using digital microfluidic techniques, and all steps of the gene sequencing from library preparation to gene sequencing can be completed on one chip.