Signal Conditioner, Antenna Device and Manufacturing Method

    公开(公告)号:US20210210851A1

    公开(公告)日:2021-07-08

    申请号:US16763404

    申请日:2019-12-13

    IPC分类号: H01Q3/28 H01P3/08

    摘要: The present disclosure provides a signal conditioner, an antenna device and a manufacturing method. The signal conditioner includes: a microstrip line including a first portion and a second portion; an insulating layer including a first insulating layer covering the first portion; at least one electrode; a liquid crystal layer covering the microstrip line, the insulating layer, and the at least one electrode; and a common electrode line. A first end of the first portion is connected to a first end of the second portion. A second end of the first portion is connected to a second end of the second portion. The at least one electrode includes a first electrode on a side of the first insulating layer facing away from the first portion. The common electrode line is on a side of the liquid crystal layer facing away from the microstrip line.

    PHASE-SHIFT UNIT, PHASE SHIFTER AND ANTENNA

    公开(公告)号:US20220158347A1

    公开(公告)日:2022-05-19

    申请号:US17649708

    申请日:2022-02-02

    IPC分类号: H01Q3/36 H01Q1/38 H01Q1/48

    摘要: A phase-shift unit includes: a first substrate and a second substrate provided opposite to each other; a medium layer provided between the first substrate and the second substrate; a microstrip line disposed at a side of the second substrate facing towards the first substrate; and a grounding layer provided at a side of the first substrate facing towards the second substrate and formed with a via hole; wherein a projection of the via hole onto the second substrate and a projection of the microstrip line onto the second substrate have an overlapped area therebetween; and wherein the via hole is configured to feed a phase-shifted microwave signal out of the phase-shift unit, or feed a microwave signal into the phase-shift unit such that the microwave signal is phase-shifted.

    Gene sequencing chip and gene sequencing method

    公开(公告)号:US11291970B2

    公开(公告)日:2022-04-05

    申请号:US16071932

    申请日:2018-01-02

    摘要: A gene sequencing chip is provided, which includes: an upper substrate including a plurality of liquid inlets for inletting liquid drops; a lower substrate opposite to the upper substrate and spaced therefrom by a gap, the gap being provided for allowing the liquid drops to move therein, the lower substrate including a liquid drop operation region, the liquid drop operation region including a manipulation electrode array. The manipulation electrode array includes multiple first sub-arrays for preparing a gene library, multiple second sub-arrays for sequencing the gene library which is prepared, each first sub-array being adjacent to one of the multiple second sub-arrays. Based on the gene sequencing chip provided in this disclosure, operations to tiny liquid drops such as movement, fusion and splitting can be accurately manipulated by using digital microfluidic techniques, and all steps of the gene sequencing from library preparation to gene sequencing can be completed on one chip.