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公开(公告)号:US20180158656A1
公开(公告)日:2018-06-07
申请号:US15866878
申请日:2018-01-10
发明人: Jinrong ZHAO , Shaohua LIU , Gang WEI , Yulin PENG , Meng YANG , Yali FU
IPC分类号: H01J37/32 , H01L29/78 , H01L21/687
CPC分类号: H01J37/32715 , H01J37/3211 , H01J37/32183 , H01J37/32477 , H01J37/32816 , H01J37/32834 , H01L21/3065 , H01L21/68714 , H01L29/78 , H01L29/785
摘要: Some embodiments of the present disclosure provide a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus includes a chamber, a support and a liner. The chamber is configured for plasma processes and includes a chamber wall. The support is configured to hold a wafer in the chamber. The liner is configured to surround the support and includes a top side and a bottom side. The top side is detachably hung on the chamber wall. The bottom side includes gas passages for plasma particles to pass through the liner.