公开(公告)号：US20240234088A1

公开(公告)日：2024-07-11

申请号：US18616998

申请日：2024-03-26

Applicant: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.

Inventor： Jing WEI ,  Yu ZHANG ,  Gang WEI ,  Guodao SHAN ,  Chenyu ZHONG ,  Yanyan YOU ,  Jing YANG

IPC: H01J37/32

CPC classification number: H01J37/321 ,  H01J37/32183 ,  H01J37/32577

Abstract: A power control method of a lower RF power supply of semiconductor processing equipment includes, when a processing chamber starts semiconductor processing, with a predetermined power compensation equation and according to a pre-obtained first RF circuit parameter set of a reference chamber and a second RF circuit parameter set of a present processing chamber performing the semiconductor processing, obtaining a power compensation coefficient of the present processing chamber relative to the reference chamber, according to the power compensation coefficient and a power setting value of the lower RF power supply of the present processing chamber, calculating a power compensation value of the present processing chamber relative to the reference chamber, and controlling the lower RF power supply to output the power compensation value.

公开(公告)号：US20230411120A1

公开(公告)日：2023-12-21

申请号：US18254055

申请日：2021-11-23

Applicant: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.

Inventor： Jing YANG ,  Chenyu ZHONG ,  Gang WEI

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32577 ,  H01J37/32935 ,  H01J2237/334

Abstract: The present disclosure provides a semiconductor process apparatus and a plasma ignition method. The semiconductor process apparatus includes a reaction chamber, an air inlet assembly configured to introduce the reaction gas into the reaction chamber, an upper electrode assembly configured to excite the reaction gas into the plasma, a monitor configured to monitor the electromagnetic radiation intensity of the plasma in the reaction chamber when the plasma is ignited, a controller configured to determine whether the electromagnetic radiation intensity monitored by the monitor reaches the preset intensity, if yes, determine that the plasma ignition is successful, and after the plasma ignition is successful, control the upper electrode assembly to perform the impedance matching of the first preset duration. In the present disclosure, the consistency of the process results may be improved to improve the uniformity of the products.