公开(公告)号：US20120003765A1

公开(公告)日：2012-01-05

申请号：US13232391

申请日：2011-09-14

申请人： BILY WANG ,  SHIH-YU WU ,  CHAO-YUAN HUANG ,  PING-CHOU YANG ,  CHENG-YEN CHIANG

发明人： BILY WANG ,  SHIH-YU WU ,  CHAO-YUAN HUANG ,  PING-CHOU YANG ,  CHENG-YEN CHIANG

IPC分类号： H01L33/52

CPC分类号： H01L33/52 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.

摘要翻译： 使用沉淀的LED芯片封装结构包括封装体，至少两个导电基板，至少一个发光元件和封装单元。 包装体具有接收空间。 两个导电基板被接收在接收空间中。 发光元件被容纳在接收空间中并与两个导电基板电连接。 包装单元具有包装胶体层和混合到包装胶体层中的粉末，并且包装单元填充到容纳空间中。 首先将包装单元保持在室温下，将粉末均匀地沉积在接收空间中，并通过加热到预定温度使粉末在接收空间中固化。