-
公开(公告)号：US11088296B2
公开(公告)日：2021-08-10
申请号：US16507262
申请日：2019-07-10
发明人： Long Wang , Yanzhao Li , Chieh Hsing Chung , Jie Sun
IPC分类号： H01L33/00 , H01L33/62 , H01L25/075 , H01L27/15
摘要： A light-emitting diode (LED) substrate and a manufacturing method thereof, and a display device are provided. The LED substrate includes a receiving substrate, the receiving substrate is provided thereon with a pixel definition layer and a plurality of LED units, the pixel definition layer defines a plurality of sub-pixel regions, each of the plurality of sub-pixel regions is configured to receive at least one of the plurality of LED units, and a solder point and an auxiliary metal member are both provided in the sub-pixel region, the auxiliary metal member is provided at a periphery of the solder point, an interval is provided between the solder point and the auxiliary metal member in a plan view of the receiving substrate, and a melting point of the auxiliary metal member is higher than a melting point of the solder point.
-
公开(公告)号：US11302260B2
公开(公告)日：2022-04-12
申请号：US16470659
申请日：2018-11-13
发明人： Chieh Hsing Chung
IPC分类号： G09G3/3275 , G09G3/3266
摘要： A signal processing circuit and a driving method thereof, a display panel and a driving method thereof, and a display device are disclosed. The signal processing circuit includes a shunting circuit and N buffer circuits. The shunting circuit includes N output nodes, the N buffer circuits are respectively connected with the N output nodes. The shunting circuit is configured to output input signals to the N output nodes respectively at N different time points in response to control signals. Each of the N buffer circuits is configured to buffer and output the input signal received by a corresponding output node. N is an integer great than or equal to 2.
-
3.发明授权公开(公告)号：US10651429B2
公开(公告)日：2020-05-12
申请号：US15570891
申请日：2017-04-12
发明人： Jie Sun , Chung Chun Lee , Chieh Hsing Chung
摘要： An organic light-emitting diode (OLED) illuminating lamp sheet and a manufacturing method thereof are provided. The method for manufacturing an OLED illuminating lamp sheet includes: manufacturing an array substrate, the array substrate includes a first base and a first electrode formed on the first base; bonding an electrostatic film to a surface of the array substrate provided with the first electrode, forming a patterned electrostatic film by patterning the electrostatic film, and forming an organic film layer by taking the patterned electrostatic film as a mask; forming a second electrode and obtaining an OLED element; and encapsulating the OLED element and obtaining an OLED illuminating lamp sheet.
-
公开(公告)号：US20210202599A1
公开(公告)日：2021-07-01
申请号：US16071554
申请日：2017-12-15
发明人： Boris Kristal , Chieh Hsing Chung
摘要： Provided are an OLED display substrate (100) and an OLED display device, in the field of display device. The OLED display substrate (100) includes a plurality of pixels, and each of the pixels includes two sub-pixels. The two sub-pixels include a first sub-pixel (210) and a second sub-pixel (220). The first sub-pixel (210) includes a first light-emitting unit (211) and a second light-emitting unit (212) that are stacked; the second sub-pixel (220) includes a third light-emitting unit (213); and the first light-emitting unit (211), the second light-emitting unit (212) and the third light-emitting unit (213) are configured to emit lights with different colors. Under the same resolution, the aperture ratio of the OLED display substrate (100) may be increased. Alternatively, under the same size of sub-pixels, the resolution of the OLED display substrate (100) may be increased. Therefore, the brightness uniformity and display effect of the OLED display panel are improved.
-
公开(公告)号：US10396237B2
公开(公告)日：2019-08-27
申请号：US15542234
申请日：2017-01-06
发明人： Long Wang , Yanzhao Li , Chieh Hsing Chung , Jie Sun
IPC分类号： H01L33/00 , H01L27/15 , H01L25/075
摘要： A light-emitting diode substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of a light-emitting diode (LED) substrate, including: disposing a supporting substrate supporting a plurality of LED units to be opposed to a receiving substrate so that a side of the supporting substrate facing the receiving substrate supports the plurality of LED units; and irradiating a side of the supporting substrate away from the receiving substrate with laser, stripping the LED units from the supporting substrate, and transferring the LED units onto the receiving substrate. The manufacturing method of the LED substrate can better transfer LED units from the supporting substrate onto the receiving substrate.
-
公开(公告)号：US11271047B2
公开(公告)日：2022-03-08
申请号：US16071554
申请日：2017-12-15
发明人： Boris Kristal , Chieh Hsing Chung
摘要： Provided are an OLED display substrate (100) and an OLED display device, in the field of display device. The OLED display substrate (100) includes a plurality of pixels, and each of the pixels includes two sub-pixels. The two sub-pixels include a first sub-pixel (210) and a second sub-pixel (220). The first sub-pixel (210) includes a first light-emitting unit (211) and a second light-emitting unit (212) that are stacked; the second sub-pixel (220) includes a third light-emitting unit (213); and the first light-emitting unit (211), the second light-emitting unit (212) and the third light-emitting unit (213) are configured to emit lights with different colors. Under the same resolution, the aperture ratio of the OLED display substrate (100) may be increased. Alternatively, under the same size of sub-pixels, the resolution of the OLED display substrate (100) may be increased. Therefore, the brightness uniformity and display effect of the OLED display panel are improved.
-
公开(公告)号：US20190334057A1
公开(公告)日：2019-10-31
申请号：US16507262
申请日：2019-07-10
发明人： Long Wang , Yanzhao Li , Chieh Hsing Chung , Jie Sun
摘要： A light-emitting diode (LED) substrate and a manufacturing method thereof, and a display device are provided. The LED substrate includes a receiving substrate, the receiving substrate is provided thereon with a pixel definition layer and a plurality of LED units, the pixel definition layer defines a plurality of sub-pixel regions, each of the plurality of sub-pixel regions is configured to receive at least one of the plurality of LED units, and a solder point and an auxiliary metal member are both provided in the sub-pixel region, the auxiliary metal member is provided at a periphery of the solder point, an interval is provided between the solder point and the auxiliary metal member in a plan view of the receiving substrate, and a melting point of the auxiliary metal member is higher than a melting point of the solder point.
-
公开(公告)号：US09681074B2
公开(公告)日：2017-06-13
申请号：US15103979
申请日：2015-10-20
发明人： Liye Duan , Chung-Chun Lee , Feng Jiang , Li Zhou , Long Wang , Chieh Hsing Chung
CPC分类号： H04N5/357 , G01T1/247 , G09G3/00 , H04N5/32 , H04N5/365 , H04N5/3745 , H04N5/37457 , H04N5/66
摘要： A pixel circuit is provided. The pixel circuit includes a photoelectric converter unit, an amplifier unit, a reset unit, a compensation unit, a charging unit, and a readout unit, wherein the photoelectric converter unit is connected to a first voltage terminal and the amplifier unit, and is configured to convert an optical signal into an electric signal, wherein the amplifier unit is connected to the photoelectric converter unit, the charging unit, and the readout unit, and is configured to amplify an output signal from the photoelectric converter unit, and wherein the reset unit is connected to a reset terminal, the first voltage terminal, and the amplifier unit, and is configured to reset the amplifier unit based on an input signal from the reset terminal and an input signal from the first voltage terminal.
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.018 秒)
