LIGHT-EMITTING DIODE SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

    公开(公告)号:US20190334057A1

    公开(公告)日:2019-10-31

    申请号:US16507262

    申请日:2019-07-10

    IPC分类号: H01L33/00 H01L27/15

    摘要: A light-emitting diode (LED) substrate and a manufacturing method thereof, and a display device are provided. The LED substrate includes a receiving substrate, the receiving substrate is provided thereon with a pixel definition layer and a plurality of LED units, the pixel definition layer defines a plurality of sub-pixel regions, each of the plurality of sub-pixel regions is configured to receive at least one of the plurality of LED units, and a solder point and an auxiliary metal member are both provided in the sub-pixel region, the auxiliary metal member is provided at a periphery of the solder point, an interval is provided between the solder point and the auxiliary metal member in a plan view of the receiving substrate, and a melting point of the auxiliary metal member is higher than a melting point of the solder point.

    Splicing screen, method for determining address of each splicing screen unit and master control board

    公开(公告)号:US10255017B2

    公开(公告)日:2019-04-09

    申请号:US15150952

    申请日:2016-05-10

    发明人: Jie Sun

    IPC分类号: G06F3/14 G09G5/00

    摘要: The present disclosure provides a splicing screen, a method for determining an address of each splicing screen unit and a master control board. The splicing screen includes a plurality of splicing screen units which are spliced together. Each splicing screen unit includes a master control board, a gravity sensor coupled with the master control board, infrared emitters and infrared receivers. The infrared emitters and the infrared receivers are divided into four groups each including one infrared emitter and one infrared receiver; the four groups are at four sides including top, bottom, left and right sides of each splicing screen unit, respectively. At adjacent sides of adjacent two splicing screen units, two groups have an identical horizontal position or an identical vertical position. In adjacent two splicing screen units, signal is capable of being transmitted among infrared emitters and infrared receivers of only two groups at adjacent sides of adjacent two splicing screen units.

    Quantum dot light-emitting device, fabricating method thereof, and display substrate

    公开(公告)号:US10217953B2

    公开(公告)日:2019-02-26

    申请号:US15539315

    申请日:2016-11-30

    摘要: A quantum dot light-emitting device, a fabricating method thereof, and a display substrate are provided. The quantum dot light-emitting device includes: a base substrate; a first electrode layer, a light-emitting layer, a second electrode layer and an encapsulation layer which are sequentially formed on the base substrate, wherein the light-emitting layer includes a quantum dot light emitting material; a fluorescent material is disposed between the first electrode layer and the second electrode layer, and the fluorescent material includes a thermally activated delayed fluorescence (TADF) material; one of the first electrode layer and the second electrode layer is an anode layer, and the other of the first electrode layer and the second electrode layer is a cathode layer.

    Light-emitting diode substrate and manufacturing method thereof, and display device

    公开(公告)号:US11088296B2

    公开(公告)日:2021-08-10

    申请号:US16507262

    申请日:2019-07-10

    摘要: A light-emitting diode (LED) substrate and a manufacturing method thereof, and a display device are provided. The LED substrate includes a receiving substrate, the receiving substrate is provided thereon with a pixel definition layer and a plurality of LED units, the pixel definition layer defines a plurality of sub-pixel regions, each of the plurality of sub-pixel regions is configured to receive at least one of the plurality of LED units, and a solder point and an auxiliary metal member are both provided in the sub-pixel region, the auxiliary metal member is provided at a periphery of the solder point, an interval is provided between the solder point and the auxiliary metal member in a plan view of the receiving substrate, and a melting point of the auxiliary metal member is higher than a melting point of the solder point.

    Organic light-emitting diode (OLED) illuminating lamp sheet and manufacturing method thereof

    公开(公告)号:US10651429B2

    公开(公告)日:2020-05-12

    申请号:US15570891

    申请日:2017-04-12

    IPC分类号: H01L51/56 H01L51/52 H01L27/32

    摘要: An organic light-emitting diode (OLED) illuminating lamp sheet and a manufacturing method thereof are provided. The method for manufacturing an OLED illuminating lamp sheet includes: manufacturing an array substrate, the array substrate includes a first base and a first electrode formed on the first base; bonding an electrostatic film to a surface of the array substrate provided with the first electrode, forming a patterned electrostatic film by patterning the electrostatic film, and forming an organic film layer by taking the patterned electrostatic film as a mask; forming a second electrode and obtaining an OLED element; and encapsulating the OLED element and obtaining an OLED illuminating lamp sheet.