Magnetic device, vapor deposition device and vapor deposition method

    公开(公告)号:US09650709B2

    公开(公告)日:2017-05-16

    申请号:US14435119

    申请日:2014-08-28

    CPC classification number: C23C14/042 C23C14/12 C23C14/54

    Abstract: The present disclosure provides a magnetic device and a vapor deposition device. The magnetic device is configured to adsorb a metal mask in the vapor deposition device, including: a metal plate; an electromagnet array including a plurality of electromagnets; each of the electromagnets being inserted in the metal plate; a power supply module configured to supply a current; a control module configured to, when adsorbing the metal mask during a vapor deposition process, control the power supply module to supply a direct current to all or some of the plurality of electromagnets and control a direction and a size of the direct current by sending a first control signal to the power supply module.

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