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公开(公告)号:US09910356B2
公开(公告)日:2018-03-06
申请号:US14894699
申请日:2015-04-27
发明人: Lei Zhang , Zhuyi Luo , Xiangming Meng , Jinho Youn , Jianqiang Guo , Honglin Liao
CPC分类号: G03F7/2022 , G03F7/0007 , G03F7/16 , G03F7/2008 , G03F7/203 , G03F7/32 , G03F7/40
摘要: A method of patterning a thin film is provided. The method includes coating a thin film layer and photoresist on a surface of a substrate; forming a first partially cured zone by performing a first exposing process of the photoresist with a mask, wherein exposing energy applied to the photoresist of the first partially cured zone is less than a photosensitive threshold of the photoresist; forming a cured zone on the first partially cured zone by performing a second exposing process of the photoresist with the mask, wherein a width of the cured zone is less than a width of the first partially cured zone, and exposing energy applied to the photoresist of the cured zone is equal to or greater than the photosensitive threshold of the photoresist; developing the photoresist; etching the thin film layer that is not covered by the photoresist; and removing the photoresist of the cured zone.