Encapsulation structure, display panel, electronic device and encapsulation method

    公开(公告)号:US10673014B2

    公开(公告)日:2020-06-02

    申请号:US16555112

    申请日:2019-08-29

    IPC分类号: H01L51/52 H01L51/56 H01L27/32

    摘要: An encapsulation structure, a display panel, an electronic device and an encapsulation method are provided. The encapsulation structure includes: a first substrate and a second substrate, and a first sealant and a second sealant bonding the first substrate and the second substrate to each other. The first sealant includes a first inclined surface; the second sealant includes a second inclined surface which is attached to and in direct contact with the first inclined surface. In a direction parallel to the first substrate, each of the first inclined surface and the second inclined surface extends from a first position to a second position. Along a direction from the first position to the second position, a distance from the first inclined surface to the first substrate and a distance from the second inclined surface to the second substrate gradually change; and sums of the two distances are substantially equal.

    Display panel, manufacturing method thereof, and display device

    公开(公告)号:US11271064B2

    公开(公告)日:2022-03-08

    申请号:US16438576

    申请日:2019-06-12

    发明人: Zihua Li Jing Liu

    IPC分类号: H01L27/32 H01L51/52

    摘要: A display panel, a manufacturing method thereof, and a display device are provided. The display panel includes: a first base substrate including a packaging region; a plurality of support portions located in the packaging region, a first interval being provided between adjacent support portions; a plurality of conductive lines located at a side of the plurality of support portions away from the first base substrate; a packaging layer located at a side of the plurality of conductive lines away from the first base substrate; and a second base substrate arranged opposite to the first base substrate and bonded with the first base substrate by the packaging layer.