Film Thickness Control System, Film Thickness Control Method, Evaporation Device and Evaporation Method

    公开(公告)号:US20170298501A1

    公开(公告)日:2017-10-19

    申请号:US15312766

    申请日:2016-02-05

    IPC分类号: C23C14/54 G01B11/06

    摘要: A film thickness control system and a film thickness control method for an evaporation device, an evaporation device and an evaporation method are disclosed. The film thickness control system includes: a driving device, a film thickness meter and a computer; the film thickness meter is mounted on the driving device, connected with the computer, and configured to acquire a coordinate of a measured position of a substrate to be measured from the computer and send an actual film thickness of the measured position to the computer; and the computer is configured, when the actual film thickness does not exceed an error range of a preset film thickness, to calculate a new compensation value according to the actual film thickness, the preset film thickness and a current compensation value, and send the new compensation value to the evaporation device as reference for compensating evaporation.

    Folding device
    3.
    发明授权

    公开(公告)号:US11926499B2

    公开(公告)日:2024-03-12

    申请号:US17631090

    申请日:2021-04-09

    摘要: A folding device is provided. The folding device includes a bearing and fixing mechanism (1) configured to bear and fix a main body portion (21) of a to-be-folded device (2); a folding mechanism (3) located on at least one side of the bearing and fixing mechanism (1), the folding mechanism (3) being rotatably connected to the bearing and fixing mechanism (1) and configured to bear and fix a to-be-folded portion (22) of the to-be-folded device (2); and a driving mechanism (4) connected to the folding mechanism (3), the driving mechanism (4) being configured to drive the folding mechanism (3) to turn relative to the bearing and fixing mechanism (1), so as to fold the to-be-folded portion (22) to a side in a thickness direction of the main body portion (21). The folding device can fold automatically, and manual folding is avoided.

    Display panel and display device, and fabrication methods thereof

    公开(公告)号:US10209546B2

    公开(公告)日:2019-02-19

    申请号:US15571163

    申请日:2017-06-20

    摘要: Display panel and display device, and fabrication methods are provided. The method for fabricating the display panel includes forming a protective layer at least on a bending region, the bending region being in a non-display region containing peripheral circuits of the display panel, to cover the peripheral circuits, and folding the display panel at the bending region towards a back surface of the display panel. When the display panel is folded at the bending region towards the back surface of the display panel, the protective layer coated on the bending region provides protection for the peripheral circuits formed on the surface of the bending region.

    Device and system for testing flatness

    公开(公告)号:US11948845B2

    公开(公告)日:2024-04-02

    申请号:US17483613

    申请日:2021-09-23

    IPC分类号: G01B11/30 H01L21/66 H01L21/02

    摘要: The present disclosure relates to a device and a system for testing flatness. The device for testing flatness includes a base, a testing platform, and a ranging sensor. The testing platform is assembled on the base. The testing platform includes a supporting structure. The supporting structure is disposed on the side of the testing platform away from the base and is used to support a to-be-tested board. The structure matches the structure of the to-be-tested board. The ranging sensor is disposed on the side of the testing platform away from the base. After the to-be-tested board is placed on the testing platform, the ranging sensor is used to test distances between a number N of to-be-tested positions on the to-be-tested board and the ranging sensor, to obtain N pieces of distance information, and the N pieces of distance information are used to determine the flatness of the to-be-tested board, where N is an integer greater than 2. According to the embodiments of the present disclosure, the flatness of the glass substrate can be tested to improve the manufacturing process to reduce the flatness of the glass substrate, and avoid the problem that the glass substrate is easily broken when entering the subsequent process equipment and the process equipment is down.

    Chip on film and display device
    8.
    发明授权

    公开(公告)号:US10340215B2

    公开(公告)日:2019-07-02

    申请号:US15538340

    申请日:2016-05-16

    摘要: Disclosed are a chip on film and a display device. the chip on film includes a plurality of output pads independent from each other extending in the first direction on a side of a base material; correspondingly, a flexible display panel in the display device includes a plurality of input pads in one-to-one correspondance with output pads extending in the first direction in the bonding region. The chip on film can improve the bonding yield and stability of the display device.

    EVAPORATION APPARATUS
    10.
    发明申请
    EVAPORATION APPARATUS 审中-公开
    蒸发装置

    公开(公告)号:US20170058396A1

    公开(公告)日:2017-03-02

    申请号:US15151635

    申请日:2016-05-11

    IPC分类号: C23C14/24 C23C14/50

    CPC分类号: C23C14/24

    摘要: An evaporation apparatus is disclosed. The evaporation apparatus includes: an evaporation chamber; a carrier, disposed in the evaporation chamber and employed to bear a substrate onto which an evaporation material is to be evaporated; a longitudinal rail, fixed below the carrier; a first horizontal rail, connected with the longitudinal rail, the first horizontal rail being movable upwardly and downwardly along the longitudinal rail to come close to or move away from the carrier; and a heating source plate, disposed in the evaporation chamber, the heating source plate being movable onto the first horizontal rail and being movable upwardly and downwardly along with the first horizontal rail.

    摘要翻译: 公开了一种蒸发装置。 蒸发装置包括:蒸发室; 载体,设置在蒸发室中并用于承载要蒸发物质的基底; 一个固定在载体下面的纵向轨道; 与所述纵向轨道连接的第一水平轨道,所述第一水平轨道沿着所述纵向轨道可向上和向下移动以接近或远离所述载体; 以及设置在所述蒸发室中的所述加热源板,所述加热源板可移动到所述第一水平导轨上并且可与所述第一水平导轨一起上下移动。