Filling device and apparatus, electrochemical deposition system and filling method

    公开(公告)号:US12024787B2

    公开(公告)日:2024-07-02

    申请号:US17514971

    申请日:2021-10-29

    IPC分类号: C25D21/14 C25D17/00

    CPC分类号: C25D21/14 C25D17/00

    摘要: The present disclosure relates to a filling device and apparatus, an electrochemical deposition system, and a filling method. The filling device includes: a feeding structure including a first feed port and a first discharge port; a container including a second feed port and a second discharge port; a weighing means disposed on the container; a conveying structure disposed between the first discharge port and the second feed port, the second feed port being in communication with the first discharge port via the conveying structure, and the conveying structure being configured to convey a material output from the first discharge port to the second feed port; and a control structure connected to the weighing means and the conveying structure, respectively, and configured to control a conveying speed of the conveying structure according to the weight detected by the weighing means.