公开(公告)号：US20160252792A1

公开(公告)日：2016-09-01

申请号：US14769232

申请日：2015-04-20

申请人： BOE Technology Group Co., Ltd. ,  Hefei Xinsheng Optoelectronics Technology Co., Ltd.

发明人： Lei HAN ,  Tao WU ,  Pingyu WEI ,  Hewei WANG

IPC分类号： G02F1/1362 ,  G02F1/1343 ,  H01L27/12 ,  G02F1/1333

CPC分类号： H01L22/30 ,  G02F1/133345 ,  G02F1/13439 ,  G02F1/136204 ,  G02F1/136286 ,  G02F2001/136254 ,  G02F2001/13629 ,  G02F2203/69 ,  H01L27/124 ,  H01L27/1244

摘要： The present invention provides a short-circuit unit comprising: a plurality of signal lines divided into a plurality of groups, each group comprising multiple signal lines, and the multiple signal lines in a same group are not adjacent to each other; a plurality of short-circuit lines, each group of the signal lines correspond to one short-circuit line, and the short-circuit line electrically connects all of the signal lines in the group corresponding to the short-circuit line, the plurality of short-circuit lines are disposed in different layers and the short-circuit lines in different layers are insulated from each other. The present invention also provides an array substrate. In the short-circuit unit of the present invention, the short-circuit lines are disposed in different layers. Compared to the existing solutions in which the short-circuit lines are provided in a same layer, the width occupied by the short-circuit unit of the present invention is smaller.

摘要翻译： 本发明提供了一种短路单元，包括：分成多个组的多个信号线，每个组包括多个信号线，同一组中的多个信号线彼此不相邻; 多条短路线，各组信号线对应于一条短路线，短路线电连接与短路线对应的组中的所有信号线，多条短路线 电路线设置在不同的层中，并且不同层中的短路线彼此绝缘。 本发明还提供一种阵列基板。 在本发明的短路单元中，短路线设置在不同的层中。 与将短路线设置在同一层中的现有方案相比，本发明的短路单元占用的宽度较小。

公开(公告)号：US20160342054A1

公开(公告)日：2016-11-24

申请号：US14888643

申请日：2015-05-12

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.

发明人： Pingyu WEI ,  Lei HAN ,  Dong GUO ,  Tao WU

IPC分类号： G02F1/1362

CPC分类号： G02F1/136259 ,  B23K26/0093 ,  B23K26/032 ,  B23K26/0876 ,  B23K26/34 ,  B23K26/702 ,  B23K2101/42 ,  G02F1/1303 ,  G02F1/1309 ,  G02F1/13452 ,  G02F2001/136263 ,  H01L23/5254 ,  H05K1/0306 ,  H05K3/225 ,  H05K3/28 ,  H05K2201/10128 ,  H05K2203/107 ,  H05K2203/108

摘要： The present disclosure provides a method and a device for repairing a metal wire. The method includes: locating a first position on the metal wire to be repaired, the first position being at a first side of a break point on the metal wire to be repaired; and outputting a first laser beam in such a manner as to move from the first position toward the break point and scan a portion of the metal wire between the first position and the break point, so as to fuse the portion of the metal wire and enable fused metal to flow toward the break point to fill the break point.

摘要翻译： 本公开提供了一种用于修理金属线的方法和装置。 该方法包括：将待修复的金属线上的第一位置定位在第一位置处于要修复的金属线上的断点的第一侧; 并且以从第一位置朝向断点移动的方式输出第一激光束，并且在第一位置和断点之间扫描金属线的一部分，以熔合金属线的部分并使能 熔融金属流向断点以填满断点。