公开(公告)号：US20200043677A1

公开(公告)日：2020-02-06

申请号：US16050015

申请日：2018-07-31

Applicant: Bose Corporation

Inventor： Daniel D. Gonsalves ,  Seth Mann ,  Allen T. Graff ,  Edgardo Alicea

IPC: H01H13/06

Abstract: A structure for interfacing a plunger that is exposed outside of a housing and is constructed and arranged to be pushed in relative to the housing so as to operate a switch that is located inside of the housing. The structure has an elastic portion that is constructed and arranged to interface with the plunger so as to maintain the plunger in the housing and a stiff portion that is coupled to the elastic portion and is constructed and arranged to interface with the housing so as to capture the structure in the housing.

公开(公告)号：US20150139458A1

公开(公告)日：2015-05-21

申请号：US14560177

申请日：2014-12-04

Applicant: Bose Corporation

Inventor： Matthew Neil Ruwe ,  Daniel D. Gonsalves

IPC: H04R5/033 ,  H04R1/10

CPC classification number: H04R5/033 ,  F21V21/084 ,  H04R1/028 ,  H04R1/1025 ,  H04R1/1091 ,  H04R2420/03 ,  H04S7/304

Abstract: A device for coupling to a connector on an ear cup of a headset includes a mating connector corresponding to the connector of the headset. The mating connector includes a crossover conductor coupled to a first and a second terminal within the mating connector, a position sensor for determining a position of the device, and a data connection outputting data from the position sensor. The position data is usable to adjust three-dimensional audio signals to account for the direction the user is looking.

Abstract translation: 用于耦合到耳机的耳罩上的连接器的装置包括对应于耳机的连接器的匹配连接器。 配合连接器包括耦合到匹配连接器内的第一和第二端子的交叉导体，用于确定装置的位置的位置传感器以及从位置传感器输出数据的数据连接。 位置数据可用于调整三维音频信号以解决用户正在寻找的方向。

公开(公告)号：US20230131605A1

公开(公告)日：2023-04-27

申请号：US18084021

申请日：2022-12-19

Applicant: Bose Corporation

Inventor： Thomas George Andrikowich ,  Daniel D. Gonsalves

IPC: H05F3/02 ,  H04R3/00 ,  H04R1/10

Abstract: Various aspects include electronic devices with connection-enhancing, electrostatic discharge (ESD) protection features. In some examples, an electronic device includes: a housing; and a detent spring internal to the housing, where the detent spring (i) is positioned to contact a feature that is at least partially external to the housing and (ii) functions as an electrostatic discharge (ESD) sink.

公开(公告)号：US20240334666A1

公开(公告)日：2024-10-03

申请号：US18126513

申请日：2023-03-27

Applicant: Bose Corporation

Inventor： James Piper Miglietta ,  Daniel D. Gonsalves

IPC: H05K9/00 ,  C09D5/24 ,  G06F1/16 ,  G06F1/18 ,  H04R1/10

CPC classification number: H05K9/0067 ,  C09D5/24 ,  G06F1/163 ,  G06F1/182 ,  H04R1/1091

Abstract: Various aspects include wearable devices with electrostatic discharge (ESD) mitigating features. In some examples, a control module is configured to connect to a wearable device, the control module including: a housing having at least one electrostatic discharge (ESD) ingress location, an electronic component in the housing, and a shield plate contained in the housing and connected to ground, the shield plate providing ESD protection for the electronic component.

公开(公告)号：US20200221209A1

公开(公告)日：2020-07-09

申请号：US16239934

申请日：2019-01-04

Applicant: BOSE CORPORATION

Inventor： Richard Arthur Grebe ,  Daniel D. Gonsalves ,  Daniel H. Sargent

IPC: H04R1/10 ,  H04R1/02 ,  H01M2/02 ,  H01M2/10

Abstract: Systems and methods are directed to a headphone having a headphone cap and a headphone housing. The headphone cap is mechanically coupled to a printed circuit board (PCB) which has a first electrical connector and a second electrical connector. The headphone housing is configured to be mechanically coupled with the headphone cap, and comprises a battery having a third electrical connector and a fourth electrical connector. The third electrical connector is configured to form a first electrical connection with the first electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. The fourth electrical connector is configured to form a second electrical connection with the second electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. In mechanically coupling the headphone housing to the headphone cap, the battery is configured to be horizontally adjacent to the PCB.

公开(公告)号：US10805707B2

公开(公告)日：2020-10-13

申请号：US16239934

申请日：2019-01-04

Applicant: BOSE CORPORATION

Inventor： Richard Arthur Grebe ,  Daniel D. Gonsalves ,  Daniel H. Sargent

IPC: H04R25/00 ,  H04R1/10 ,  H01M2/10 ,  H01M2/02 ,  H04R1/02

Abstract: Systems and methods are directed to a headphone having a headphone cap and a headphone housing. The headphone cap is mechanically coupled to a printed circuit board (PCB) which has a first electrical connector and a second electrical connector. The headphone housing is configured to be mechanically coupled with the headphone cap, and comprises a battery having a third electrical connector and a fourth electrical connector. The third electrical connector is configured to form a first electrical connection with the first electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. The fourth electrical connector is configured to form a second electrical connection with the second electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. In mechanically coupling the headphone housing to the headphone cap, the battery is configured to be horizontally adjacent to the PCB.