公开(公告)号：US20130189524A1

公开(公告)日：2013-07-25

申请号：US13747011

申请日：2013-01-22

Applicant: Brewer Science Inc.

Inventor： Molly Hladik ,  Michael Stroder

IPC: C09D1/00

CPC classification number: C09D1/00 ,  C08K3/04 ,  C08K3/041 ,  C08K7/06 ,  C09D5/24 ,  C09D7/70 ,  C09D171/02 ,  Y10T428/31507 ,  Y10T428/31678 ,  Y10T428/31993

Abstract: Novel compositions comprising polymer solutions at various viscosities are provided. The polymer solutions are preferably fugitive, so as to avoid interfering with the properties of the nanomaterials after post-processing of the CNT-containing formulations. Additives, including acid generators, are added to the polymer solutions in order to allow the polymer carrier solutions to be degraded or decomposed at temperatures low enough to allow processing of commonly-used polymer film substrates. The invention further allows the carbon nanotube solutions to be screen printed or printed via inkjet.

Abstract translation: 提供了包含各种粘度的聚合物溶液的新型组合物。 聚合物溶液优选是非挥发性的，以避免在对含CNT制剂进行后处理之后干扰纳米材料的性质。 将添加剂，包括酸发生剂加入到聚合物溶液中，以使得聚合物载体溶液在足够低的温度下降解或分解，以允许加工通常使用的聚合物膜基材。 本发明还允许通过喷墨将丝网印刷或印刷碳纳米管溶液。

公开(公告)号：US20130288064A1

公开(公告)日：2013-10-31

申请号：US13870497

申请日：2013-04-25

Applicant: BREWER SCIENCE INC.

Inventor： Molly Hladik

IPC: C09D11/00

CPC classification number: C09D11/52 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/174 ,  D04H1/4242 ,  Y10T428/31786 ,  Y10T428/31993

Abstract: New carbon nanotube (CNT) compositions and methods of using those compositions are provided. Raw carbon nanotubes are mechanically dispersed via milling into multifunctional alcohols and mixtures of multifunctional alcohols and solvents to form pastes or dispersions that are viscous enough to be printed using standard means such as screen printing. These pastes or dispersions are stable in both dilute and concentrated solution. The invention allows films to be formed on substrates (e.g., plastics, glass, metals, ceramics).

Abstract translation: 提供了新的碳纳米管（CNT）组合物和使用这些组合物的方法。 原始碳纳米管通过研磨机械分散成多官能醇和多官能醇和溶剂的混合物，以形成粘性足以使用诸如丝网印刷的标准方法印刷的糊状物或分散体。 这些糊剂或分散体在稀释和浓缩溶液中都是稳定的。 本发明允许在基底（例如塑料，玻璃，金属，陶瓷）上形成膜。

公开(公告)号：US10519333B2

公开(公告)日：2019-12-31

申请号：US13870497

申请日：2013-04-25

Applicant: Brewer Science Inc.

Inventor： Molly Hladik

IPC: C09D11/00 ,  C09D11/52

Abstract: New carbon nanotube (CNT) compositions and methods of using those compositions are provided. Raw carbon nanotubes are mechanically dispersed via milling into multifunctional alcohols and mixtures of multifunctional alcohols and solvents to form pastes or dispersions that are viscous enough to be printed using standard means such as screen printing. These pastes or dispersions are stable in both dilute and concentrated solution. The invention allows films to be formed on substrates (e.g., plastics, glass, metals, ceramics).

公开(公告)号：US20140295656A1

公开(公告)日：2014-10-02

申请号：US14229310

申请日：2014-03-28

Applicant: Brewer Science Inc.

Inventor： Blake Waterworth ,  Steven Matthew Rich ,  Molly Hladik ,  Kirk Emory

IPC: H01L21/677 ,  H01L21/768 ,  H01L21/28 ,  H01L21/306

CPC classification number: H01L21/76898 ,  H01L21/68707 ,  H01L21/68714 ,  H01L21/68757 ,  H01L21/68785 ,  Y10T156/11 ,  Y10T156/1744 ,  Y10T156/18 ,  Y10T156/19

Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.

Abstract translation: 这里描述了晶片转移组件和在制造过程中使用组件在处理工具之间转移装置晶片的方法。 组件包括晶片转移盘，配置成接收和支撑晶片转移盘的端部执行器，以及从端部执行器延伸的细长手柄。 晶片转移盘包括晶片接合表面，其被配置为支撑位于晶片转移组件上的脱粘器件晶片，其中器件表面邻近晶片接合表面。 晶片接合表面具有不粘性，并且在晶片接合表面和器件表面之间产生低粘结强度界面。 所得到的转移堆叠可以被运送到其他处理工具以用于附加处理脱粘的器件晶片，随后分离脱粘器件晶片和晶片转移盘而不损坏器件晶片。

公开(公告)号：US09349643B2

公开(公告)日：2016-05-24

申请号：US14229310

申请日：2014-03-28

Applicant: Brewer Science Inc.

Inventor： Blake Waterworth ,  Steven Matthew Rich ,  Molly Hladik ,  Kirk Emory

IPC: H01L21/687 ,  H01L21/673 ,  H01L21/683 ,  B32B37/14 ,  B32B38/18 ,  H01L21/768 ,  B32B37/26

CPC classification number: H01L21/76898 ,  H01L21/68707 ,  H01L21/68714 ,  H01L21/68757 ,  H01L21/68785 ,  Y10T156/11 ,  Y10T156/1744 ,  Y10T156/18 ,  Y10T156/19

Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.

Abstract translation: 这里描述了晶片转移组件和在制造过程中使用组件在处理工具之间转移装置晶片的方法。 组件包括晶片转移盘，配置成接收和支撑晶片转移盘的端部执行器，以及从端部执行器延伸的细长手柄。 晶片转移盘包括晶片接合表面，其被配置为支撑位于晶片转移组件上的脱粘器件晶片，其中器件表面邻近晶片接合表面。 晶片接合表面具有不粘性，并且在晶片接合表面和器件表面之间产生低粘结强度界面。 所得到的转移堆叠可以被运送到其他处理工具以用于附加处理脱粘的器件晶片，随后分离脱粘器件晶片和晶片转移盘而不损坏器件晶片。