公开(公告)号：US20150302974A1

公开(公告)日：2015-10-22

申请号：US14684256

申请日：2015-04-10

Applicant: BROADCOM CORPORATION

Inventor： Sam Ziqun ZHAO ,  Edward LAW ,  Sampath Komarapalayam KARIKALAN ,  Neal Andrew KISTLER ,  Rezaur Rahman KHAN ,  Pieter VORENKAMP

IPC: H01F27/28 ,  H05K1/18 ,  H01F41/02 ,  H01F41/04 ,  H01F27/24 ,  H01F27/40

CPC classification number: H05K1/181 ,  H01F17/0013 ,  H01F17/045 ,  H01F38/14 ,  H01F41/046 ,  H01F2017/0053 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01L2224/16225

Abstract: A 3-dimensional (3-D) magnetic core device includes a substrate, a first magnetic shell formed on the substrate, and a first group of conductive traces embedded in a first insulator layer formed on the first magnetic shell. A magnetic core plane is formed on the first insulator layer, and a second group of conductive traces are embedded in a second insulator layer formed on the magnetic core plane. A second magnetic shell is formed on the second insulator layer, and the first and second group of conductive traces are conductively coupled by using conductive vias.

Abstract translation: 三维（3-D）磁芯装置包括基板，形成在基板上的第一磁性壳以及嵌入在形成于第一磁性壳上的第一绝缘体层中的第一组导电迹线。 磁芯平面形成在第一绝缘体层上，第二组导电迹线嵌入形成在磁芯平面上的第二绝缘体层中。 第二磁性壳体形成在第二绝缘体层上，并且第一和第二组导电迹线通过使用导电通孔导电耦合。