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公开(公告)号：US11441011B2
公开(公告)日：2022-09-13
申请号：US16074335
申请日：2017-01-31
发明人： Fumihiro Mukai , Kotaro Yamaura , Hiroki Naito , Yasuhiro Sako
IPC分类号： C08K3/38 , C08K3/22 , H01L23/373 , H01L33/64
摘要： Provided is a thermally conductive molded resin article that can be inexpensively mass-produced and that exhibits a low thermal resistance value as a result of reducing internal thermal resistance by high filling and reducing interfacial thermal resistance by improving cutting precision. The thermally conductive molded resin article is characterized by comprising a resin and thermally conductive fillers including a first thermally conductive filler and a second thermally conductive filler having a smaller particle size than the first thermally conductive filler. The thermally conductive molded resin article is also characterized in that: the first thermally conductive filler has an aspect ratio of 10 or more and is oriented approximately in the thickness direction of the thermally conductive molded resin article; the resin is a silicone resin, an acrylic rubber, or a fluororubber; and the second thermally conductive filler has a thermal conductivity surpassing 5 W/mK.
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公开(公告)号：US10941325B2
公开(公告)日：2021-03-09
申请号：US16561092
申请日：2019-09-05
发明人： Hiroki Naito , Masaya Miyake , Fumihiro Mukai
IPC分类号： C09K5/14 , H05K7/20 , H01L23/373 , F28F21/06 , H01L23/42
摘要： A thermally conductive resin molded article having a resin and a thermally conductive filler is provided. The thermally conductive filler is oriented substantially in the thickness direction of the thermally conductive resin molded article. The volumetric filling factor of the thermally conductive filler in the thermally conductive resin molded article is 20-80% by volume. Weld lines in the resin are formed substantially in the thickness direction of the thermally conductive resin molded article. An oil component is included in the thermally conductive resin molded article.
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公开(公告)号：US11267991B2
公开(公告)日：2022-03-08
申请号：US16635562
申请日：2018-07-11
发明人： Hiroki Naito , Daisuke Takagi
摘要： The present invention provides an optically clear adhesive sheet that has excellent flexibility and prevents delay bubbles in high temperature and high humidity environments. The optically clear adhesive sheet of the present invention sequentially includes a first surface-adhesive layer, an intermediate adhesive layer, and a second surface-adhesive layer. The first surface-adhesive layer and the second surface-adhesive layer each have a higher storage elastic modulus at 85° C. than the intermediate adhesive layer. The first surface-adhesive layer and the second surface-adhesive layer each have a storage elastic modulus at 85° C. of 3.0×104 Pa or higher and 30.0×104 Pa or lower. The intermediate adhesive layer has a storage elastic modulus at 85° C. of 1.0×104 Pa or higher and 15.0×104 Pa or lower. The intermediate adhesive layer contains polyurethane.
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公开(公告)号：US10457845B2
公开(公告)日：2019-10-29
申请号：US15506368
申请日：2015-08-21
发明人： Hiroki Naito , Masaya Miyake , Mukai Fumihiro
IPC分类号： C09K5/14 , F28F21/06 , H01L23/42 , H05K7/20 , H01L23/373
摘要： A thermally conductive resin molded article having a resin and a thermally conductive filler is provided. The thermally conductive filler is oriented substantially in the thickness direction of the thermally conductive resin molded article. The volumetric filling factor of the thermally conductive filler in the thermally conductive resin molded article is 20-80% by volume. Weld lines in the resin are formed substantially in the thickness direction of the thermally conductive resin molded article. An oil component is included in the thermally conductive resin molded article.
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