公开(公告)号：US20110108449A1

公开(公告)日：2011-05-12

申请号：US13007292

申请日：2011-01-14

申请人： Bartley K. ANDRE ,  Daniel J. COSTER ,  Daniele DE IULIIS ,  Richard P. HOWARTH ,  Jonathan P. IVE ,  Steve JOBS ,  Duncan Robert KERR ,  Shin NISHIBORI ,  Matthew Dean ROHRBACH ,  Peter RUSSELL-CLARKE ,  Douglas B. SATZGER ,  Calvin Q. SEID ,  Christopher J. STRINGER ,  Eugene Antony WHANG ,  Rico ZORKENDORFER ,  Vincent Keane SEID

发明人： Bartley K. ANDRE ,  Daniel J. COSTER ,  Daniele DE IULIIS ,  Richard P. HOWARTH ,  Jonathan P. IVE ,  Steve JOBS ,  Duncan Robert KERR ,  Shin NISHIBORI ,  Matthew Dean ROHRBACH ,  Peter RUSSELL-CLARKE ,  Douglas B. SATZGER ,  Calvin Q. SEID ,  Christopher J. STRINGER ,  Eugene Antony WHANG ,  Rico ZORKENDORFER ,  Vincent Keane SEID

IPC分类号： B65D85/00

CPC分类号： B65D77/26 ,  B65D25/10 ,  B65D25/54 ,  B65D77/20 ,  H04R1/1016 ,  H04R1/1091

摘要： Packaging comprising a base having an interior space for receiving an item, wherein the base includes a bottom surface and one or more side surfaces; a ledge formed along a side surface; and a holder supported by the ledge, wherein the holder includes a retaining mechanism for retaining the item.

摘要翻译： 包括包括具有用于接收物品的内部空间的底座，其中所述底座包括底表面和一个或多个侧表面; 沿着侧面形成的凸缘; 以及由所述突出部支撑的保持器，其中所述保持器包括用于保持所述物品的保持机构。

公开(公告)号：US20120228320A1

公开(公告)日：2012-09-13

申请号：US13416855

申请日：2012-03-09

申请人： Jody AKANA ,  Bartley K. ANDRE ,  Jeremy BATAILLOU ,  Daniel J. COSTER ,  Daniele DE IULIIS ,  Evans HANKEY ,  Julian HOENIG ,  Richard P. HOWARTH ,  Jonathan P. IVE ,  Duncan Robert KERR ,  Shin NISHIBORI ,  Matthew Dean ROHRBACH ,  Peter RUSSELL-CLARKE ,  Christopher J. STRINGER ,  Eugene Antony WHANG ,  Rico ZORKENDORFER

发明人： Jody AKANA ,  Bartley K. ANDRE ,  Jeremy BATAILLOU ,  Daniel J. COSTER ,  Daniele DE IULIIS ,  Evans HANKEY ,  Julian HOENIG ,  Richard P. HOWARTH ,  Jonathan P. IVE ,  Duncan Robert KERR ,  Shin NISHIBORI ,  Matthew Dean ROHRBACH ,  Peter RUSSELL-CLARKE ,  Christopher J. STRINGER ,  Eugene Antony WHANG ,  Rico ZORKENDORFER

IPC分类号： B65D51/04 ,  B31B1/62

CPC分类号： B65D5/6667

摘要： A packaging system is configured to package a product to form a packaged product assembly. The packaging system includes a lid including a major panel, side panels, and a tab extending from one of the side panels. The packaging system also includes a box hingedly coupled to the lid that includes side walls and a bottom wall with a slot defined therein. The product may be retained by the lid against the major panel by first and second end flaps. As the lid and box are folded toward one another, the product may be loaded into the box and the tab and an adhesive member coupled thereto may extend through the slot in the bottom wall of the box. The adhesive member may then be adhered to a back surface of the box to retain the product in the packaging system. Related methods are also provided.

摘要翻译： 包装系统被配置为包装产品以形成包装的产品组件。 包装系统包括盖子，其包括主面板，侧面板和从一个侧板延伸的突出部。 包装系统还包括铰接地连接到盖的盒，其包括侧壁和底壁，其中限定有狭槽。 产品可以被盖子通过第一和第二端部翼片抵靠主面板保持。 当盖和箱彼此折叠时，产品可以被装载到箱中，并且接头和与其连接的粘合构件可以延伸穿过箱的底壁中的狭槽。 然后可以将粘合剂部件粘附到箱的后表面以将产品保持在包装系统中。 还提供了相关方法。

公开(公告)号：US20110278312A1

公开(公告)日：2011-11-17

申请号：US13190312

申请日：2011-07-25

申请人： Stephen Paul ZADESKY ,  Evans HANKEY ,  Jonathan P. IVE ,  Rico ZORKENDORFER

发明人： Stephen Paul ZADESKY ,  Evans HANKEY ,  Jonathan P. IVE ,  Rico ZORKENDORFER

IPC分类号： B65D6/00 ,  B29C45/00

CPC分类号： B29C45/162 ,  B29C45/062 ,  Y10T428/1352

摘要： A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure.

摘要翻译： 提供一种用于形成用于封闭电子设备的内部电子部件的外壳的方法，其包括：执行第一注射成型工艺，所述第一注射成型工艺形成所述外壳的至少第一壁; 允许外壳的至少第一壁固化; 然后执行第二注射成型工艺，所述第二注射成型工艺形成所述外壳的至少第二壁，所述外壳的所述至少第二壁在所述第二注射成型过程期间与所述外壳的所述至少第一壁熔合， 所述外壳的所述至少第二壁形成所述外壳的至少一个不同于所述外壳的至少第一壁的不同侧面; 并且允许所述外壳的所述至少第二壁固化，所述外壳的所述至少第二壁与所述外壳的所述至少第一壁一体地形成，从而形成单件式多壁外壳。

公开(公告)号：US20100149735A1

公开(公告)日：2010-06-17

申请号：US12710261

申请日：2010-02-22

申请人： Stephen Paul ZADESKY ,  Evans HANKEY ,  Jonathan P. IVE ,  Rico ZORKENDORFER

发明人： Stephen Paul ZADESKY ,  Evans HANKEY ,  Jonathan P. IVE ,  Rico ZORKENDORFER

IPC分类号： H05K7/00 ,  B29C45/16

CPC分类号： B29C45/162 ,  B29C45/062 ,  Y10T428/1352

摘要： A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure.

摘要翻译： 提供一种用于形成用于封闭电子设备的内部电子部件的外壳的方法，其包括：执行第一注射成型工艺，所述第一注射成型工艺形成所述外壳的至少第一壁; 允许外壳的至少第一壁固化; 然后执行第二注射成型工艺，所述第二注射成型工艺形成所述外壳的至少第二壁，所述外壳的所述至少第二壁在所述第二注射成型过程期间与所述外壳的所述至少第一壁熔合， 所述外壳的所述至少第二壁形成所述外壳的至少一个不同于所述外壳的至少第一壁的不同侧面; 并且允许所述外壳的所述至少第二壁固化，所述外壳的所述至少第二壁与所述外壳的所述至少第一壁一体地形成，从而形成单件式多壁外壳。

公开(公告)号：US20130076614A1

公开(公告)日：2013-03-28

申请号：US13247942

申请日：2011-09-28

申请人： Jonathan P. IVE ,  Duncan R. Kerr ,  Matthew D. Rohrbach ,  Steve P. Hotelling ,  Christopher T. Mullens ,  Martin P. Grunthaner ,  Michael A. Cretella, JR.

发明人： Jonathan P. IVE ,  Duncan R. Kerr ,  Matthew D. Rohrbach ,  Steve P. Hotelling ,  Christopher T. Mullens ,  Martin P. Grunthaner ,  Michael A. Cretella, JR.

IPC分类号： G09G5/00 ,  G06F3/00

CPC分类号： H04M1/0245 ,  A45C11/00 ,  A45C2011/003 ,  G06F1/1626 ,  G06F1/1677 ,  G06F2200/1634 ,  H04M1/0283 ,  H04M1/72527 ,  H04M1/72575 ,  H04M2250/12

摘要： Accurate and reliable techniques for determining information of an accessory device in relation to an electronic device are described.

摘要翻译： 描述了用于确定与电子设备相关的附件设备的信息的精确和可靠的技术。