公开(公告)号：US07629728B1

公开(公告)日：2009-12-08

申请号：US12173716

申请日：2008-07-15

申请人： Baruch Pletner ,  Grace R. Kessenich ,  Wesley T. Horth

发明人： Baruch Pletner ,  Grace R. Kessenich ,  Wesley T. Horth

IPC分类号： H01L41/08

CPC分类号： H01L41/08 ,  H01L41/0475 ,  H01L41/053

摘要： A scalable piezoelectric package comprising a plurality of piezoelectric cells, each including a piezoelectric element and an external connector electrically coupled to the piezoelectric element of the respective piezoelectric cell. The piezoelectric package further comprises at least one intercellular conductor electrically coupling the piezoelectric cells together, such that the external connector of each of the piezoelectric cells is electrically coupled to the piezoelectric plate of each of the remaining piezoelectric plates of the piezoelectric cells.

摘要翻译： 一种可缩放的压电封装，包括多个压电单元，每个压电单元包括电耦合到相应的压电单元的压电元件的压电元件和外部连接器。 压电封装还包括至少一个细胞间导体，将压电元件电耦合在一起，使得每个压电单元的外部连接器电耦合到压电单元的每个剩余的压电板的压电板。

公开(公告)号：US20080202664A1

公开(公告)日：2008-08-28

申请号：US12038789

申请日：2008-02-27

申请人： Baruch Pletner ,  Grace R. Kessenich

发明人： Baruch Pletner ,  Grace R. Kessenich

IPC分类号： B32B37/00

CPC分类号： H01L41/23 ,  F16F2224/0283 ,  H01L41/053 ,  H01L41/08 ,  Y10T156/10

摘要： A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.

摘要翻译： 压电封装包括具有彼此电隔离的第一平面和第二平面的压电板。 压电封装还包括电耦合到第一平面表面的第一导电层和电耦合到第二平坦表面的第二导电层。 压电封装还包括封装压电板和第一和第二导电层的至少一部分的第一电绝缘材料（例如刚性纤维复合材料）。

公开(公告)号：US07656076B1

公开(公告)日：2010-02-02

申请号：US12173696

申请日：2008-07-15

申请人： Baruch Pletner ,  Grace R. Kessenich ,  Wesley T. Horth

发明人： Baruch Pletner ,  Grace R. Kessenich ,  Wesley T. Horth

IPC分类号： H01L41/08

CPC分类号： F16F15/005 ,  H01L41/0475 ,  H01L41/0973 ,  H01L41/312 ,  Y10T29/42

摘要： A piezoelectric package comprises an upper and lower piezoelectric plates, each having opposing electrodes. The piezoelectric package further comprises an electrically insulative structure encapsulating the piezoelectric plates. The piezoelectric package further comprises first and second external connectors mounted to the insulative structure. The connectors respectively have connector terminals that are electrically coupled to the electrodes in different orders, and have geometric arrangements that are identical, such that a single interface device can be selectively mated to either of the connectors. The piezoelectric package may be incorporated into a system that comprises electronic circuitry configured for operating the piezoelectric package, and a single interface device electrically coupled between the electronic circuitry and either of the external connectors of the piezoelectric package to selectively configure the package between a unimorph and a bimorph.

摘要翻译： 压电封装包括上和下压电板，每个具有相对的电极。 压电封装还包括封装压电板的电绝缘结构。 压电封装还包括安装到绝缘结构的第一和第二外部连接器。 连接器分别具有以不同顺序电耦合到电极的连接器端子，并且具有相同的几何布置，使得单个接口装置可以选择性地配合到任一个连接器。 压电封装可以并入到包括被配置为用于操作压电封装的电子电路的系统中，以及电耦合在电子电路和压电封装的任一个外部连接器之间的单个接口装置，以选择性地将封装配置在单压电晶片和 双压电晶片

公开(公告)号：US20100013352A1

公开(公告)日：2010-01-21

申请号：US12173696

申请日：2008-07-15

申请人： Baruch Pletner ,  Grace R. Kessenich ,  Wesley T. Horth

发明人： Baruch Pletner ,  Grace R. Kessenich ,  Wesley T. Horth

IPC分类号： H02N2/06 ,  H01L41/053 ,  H01L41/22

CPC分类号： F16F15/005 ,  H01L41/0475 ,  H01L41/0973 ,  H01L41/312 ,  Y10T29/42

摘要： A piezoelectric package comprises an upper and lower piezoelectric plates, each having opposing electrodes. The piezoelectric package further comprises an electrically insulative structure encapsulating the piezoelectric plates. The piezoelectric package further comprises first and second external connectors mounted to the insulative structure. The connectors respectively have connector terminals that are electrically coupled to the electrodes in different orders, and have geometric arrangements that are identical, such that a single interface device can be selectively mated to either of the connectors. The piezoelectric package may be incorporated into a system that comprises electronic circuitry configured for operating the piezoelectric package, and a single interface device electrically coupled between the electronic circuitry and either of the external connectors of the piezoelectric package to selectively configure the package between a unimorph and a bimorph.

摘要翻译： 压电封装包括上和下压电板，每个具有相对的电极。 压电封装还包括封装压电板的电绝缘结构。 压电封装还包括安装到绝缘结构的第一和第二外部连接器。 连接器分别具有以不同顺序电耦合到电极的连接器端子，并且具有相同的几何布置，使得单个接口装置可以选择性地配合到任一个连接器。 压电封装可以并入到包括被配置为用于操作压电封装的电子电路的系统中，以及电耦合在电子电路和压电封装的任一外部连接器之间的单个接口装置，以选择性地将封装配置在单压电晶片和 双压电晶片

公开(公告)号：US20080218026A1

公开(公告)日：2008-09-11

申请号：US12038782

申请日：2008-02-27

申请人： Baruch Pletner ,  Grace R. Kessenich

发明人： Baruch Pletner ,  Grace R. Kessenich

IPC分类号： H01L41/053 ,  H01L41/083

CPC分类号： H01L41/23 ,  F16F2224/0283 ,  H01L41/053 ,  H01L41/08 ,  Y10T156/10

摘要： A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.

摘要翻译： 压电封装包括具有彼此电隔离的第一平面和第二平面的压电板。 压电封装还包括电耦合到第一平面表面的第一导电层和电耦合到第二平坦表面的第二导电层。 压电封装还包括封装压电板和第一和第二导电层的至少一部分的第一电绝缘材料（例如刚性纤维复合材料）。

公开(公告)号：US20080203851A1

公开(公告)日：2008-08-28

申请号：US12038787

申请日：2008-02-27

申请人： Baruch Pletner ,  Grace R. Kessenich

发明人： Baruch Pletner ,  Grace R. Kessenich

IPC分类号： H01L41/04 ,  H01L41/053 ,  H01L41/083 ,  H01L41/09 ,  H01L41/113

CPC分类号： H01L41/23 ,  F16F2224/0283 ,  H01L41/053 ,  H01L41/08 ,  Y10T156/10

摘要： A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.

摘要翻译： 压电封装包括具有彼此电隔离的第一平面和第二平面的压电板。 压电封装还包括电耦合到第一平面表面的第一导电层和电耦合到第二平坦表面的第二导电层。 压电封装还包括封装压电板和第一和第二导电层的至少一部分的第一电绝缘材料（例如刚性纤维复合材料）。