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公开(公告)号：US09842749B2
公开(公告)日：2017-12-12
申请号：US15324670
申请日：2015-11-17
Applicant: Beijing University of Technology
Inventor： Guangsheng Guo , Siyu Wang , Qiaosheng Pu , Xiayan Wang
CPC classification number: H01L21/67028 , B81C1/00928 , B81C3/001 , B81C3/002 , B81C2201/0102 , B81C2201/0128 , B81C2201/0133 , B81C2201/019 , B81C2203/051 , H01L21/68
Abstract: The plasma-assisted method of precise alignment and pre-bonding for microstructure of glass and quartz microchip belongs to micromachining and bonding technologies of the microchip. The steps of which are as follows: photoresist and chromium layers on glass or quartz microchip are completely removed followed by sufficient cleaning of the surface with nonionic surfactant and quantities of ultra-pure water. Then the surface treatment is proceeded for an equipping surface with high hydrophily with the usage of plasma cleaning device. Under the drying condition, the precise alignment is accomplished through moving substrate and cover plate after being washed with the help of microscope observation. Further on, to achieve precise alignment and pre-bonding of the microstructure of glass and quartz microchip, a minute quantity of ultrapure water is instilled into a limbic crevice for adhesion, and entire water is completely wiped out by vacuum drying following sufficient squeezing. Based on the steps above, it is available to achieve permanent bonding by further adopting thermal bonding method. In summary, it takes within 30 min to finish the whole operation of precise alignment and pre-bonding by this method. Besides, this method is of great promise because of its speediness, efficiency, easy maneuverability, operational safety and wide applications.
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公开(公告)号：US20170301564A1
公开(公告)日：2017-10-19
申请号：US15324670
申请日：2015-11-17
Applicant: Beijing University of Technology
Inventor： Guangsheng Guo , Siyu Wang , Qiaosheng Pu , Xiayan Wang
CPC classification number: H01L21/67028 , B81C1/00928 , B81C3/001 , B81C3/002 , B81C2201/0102 , B81C2201/0128 , B81C2201/0133 , B81C2201/019 , B81C2203/051 , H01L21/68
Abstract: The plasma-assisted method of precise alignment and pre-bonding for microstructure of glass and quartz microchip belongs to micromachining and bonding technologies of the microchip. The steps of which are as follows: photoresist and chromium layers on glass or quartz microchip are completely removed followed by sufficient cleaning of the surface with nonionic surfactant and quantities of ultra-pure water. Then the surface treatment is proceeded for an equipping surface with high hydrophily with the usage of plasma cleaning device. Under the drying condition, the precise alignment is accomplished through moving substrate and cover plate after being washed with the help of microscope observation. Further on, to achieve precise alignment and pre-bonding of the microstructure of glass and quartz microchip, a minute quantity of ultrapure water is instilled into a limbic crevice for adhesion, and entire water is completely wiped out by vacuum drying following sufficient squeezing. Based on the steps above, it is available to achieve permanent bonding by further adopting thermal bonding method. In summary, it takes within 30 min to finish the whole operation of precise alignment and pre-bonding by this method. Besides, this method is of great promise because of its speediness, efficiency, easy maneuverability, operational safety and wide applications.
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