SELECTIVELY ACTIVATED FRANGIBLE BONDING SYSTEM

    公开(公告)号:US20190118523A1

    公开(公告)日:2019-04-25

    申请号:US15788506

    申请日:2017-10-19

    Abstract: An intentionally activated frangible bonding system comprises a frangible adhesive, adhesive primer, composite material matrix, and/or the like, having a polydispersion of at least one additive spread throughout the frangible bonding material. The additive degrades a bond provided by the frangible bonding material, upon application of a specific energy to the frangible bonding material. An energy emitter is configured to selectively direct the specific energy toward a structure or assembly comprising components bonded by the frangible bonding material to degrade the frangible bonding material bonding the components for disassembly.

    THERMALLY CONDUCTIVE CURING PROCESS FOR COMPOSITE ROTORCRAFT STRUCTURE FABRICATION

    公开(公告)号:US20200269556A1

    公开(公告)日:2020-08-27

    申请号:US16281960

    申请日:2019-02-21

    Abstract: A thermally conductive curing process adds conductive additives to create pathways for dissipating heat during a curing process, thereby reducing the cure time, increasing the output capability, and reducing cost. Conductive particles or short fibers can be dispersed throughout the resin system or composite fiber layers in pre-impregnated or RTM-processed composite material. By disposing conductive particles or short fibers in a resin as part of the curing process, heat generated during the curing process can dissipate more quickly from any type of composite, especially thick composites. Conductive additive examples include multi-walled carbon nanotubes (MWCNTs), single-walled carbon nanotubes (SWCNTs), graphene/graphite powder, buckyballs, short fibrous particulate, nano-clays, nano-particles, and other suitable materials.

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