Methods for forming composite structures

    公开(公告)号:US10899084B2

    公开(公告)日:2021-01-26

    申请号:US16036228

    申请日:2018-07-16

    Abstract: A method is provided in one example embodiment and may include forming a ply stack comprising a plurality of uncured composite plies, wherein one or more uncured composite ply of the plurality of uncured composite plies comprises a plurality of perforations that extend, at least partially, through a thickness of the one or more uncured composite ply; and compacting the ply stack to form a composite structure. The plurality of perforations may provide paths for volatiles to be removed through the thickness of the one or more uncured composite ply of the ply stack during the compacting. Volatiles may also be removed through edges of the ply stack during the compacting. In some instances, all uncured composite plies of the ply stack may include a plurality of perforations that extend, at least partially, through the thickness of each uncured composite ply.

    METHODS FOR FORMING COMPOSITE STRUCTURES
    3.
    发明申请

    公开(公告)号:US20200016880A1

    公开(公告)日:2020-01-16

    申请号:US16036228

    申请日:2018-07-16

    Abstract: A method is provided in one example embodiment and may include forming a ply stack comprising a plurality of uncured composite plies, wherein one or more uncured composite ply of the plurality of uncured composite plies comprises a plurality of perforations that extend, at least partially, through a thickness of the one or more uncured composite ply; and compacting the ply stack to form a composite structure. The plurality of perforations may provide paths for volatiles to be removed through the thickness of the one or more uncured composite ply of the ply stack during the compacting. Volatiles may also be removed through edges of the ply stack during the compacting. In some instances, all uncured composite plies of the ply stack may include a plurality of perforations that extend, at least partially, through the thickness of each uncured composite ply.

Patent Agency Ranking