Methods of Identifying Compounds Which Modulate Granulocite-Colony Stimulating Factor (G-Csf) Dependent Processes by Modulation of the Levels of Suppressor of Cytokine Signaling (Socs)
    1.
    发明申请
    Methods of Identifying Compounds Which Modulate Granulocite-Colony Stimulating Factor (G-Csf) Dependent Processes by Modulation of the Levels of Suppressor of Cytokine Signaling (Socs) 审中-公开
    通过调节细胞因子信号抑制因子水平鉴定化合物的方法,调节粒细胞集落刺激因子(G-Csf)依赖过程

    公开(公告)号:US20070275916A1

    公开(公告)日:2007-11-29

    申请号:US10559711

    申请日:2004-06-04

    摘要: The present invention relates generally to compounds which modulate cytokine-dependent processes. More particularly, the compounds of the present invention modulate responses to a colony stimulating factor and even more particularly to granulocyte-colony stimulating factor (G-CSF) by modulating the levels of molecules which inhibit G-CSF such as but not limited to a suppressor of cytokine signaling (SOCS) and in particular SOCS-3. The present invention further contemplates methods for regulating G-CSF-dependent processes by contacting cells in vitro with or administering to a subject a compound which up- or down-regulates the level of activity of G-CSF by modulating the level or activity of a SOCS molecule such as SOCS-3. The instant compounds are further useful for modulating a range of G-CSF-induced cellular responses including neutrophil recovery after chemotherapy or radiotherapy, mobilizing stem and progenitor cells, treating infection and treating inflammatory conditions.

    摘要翻译: 本发明一般涉及调节细胞因子依赖性过程的化合物。 更具体地,本发明的化合物通过调节抑制G-CSF的分子的水平来调节对集落刺激因子的反应,甚至更特别地调节粒细胞集落刺激因子(G-CSF),例如但不限于抑制因子 的细胞因子信号(SOCS),特别是SOCS-3。 本发明进一步考虑了通过使细胞在体外与受试者接触的方法来调节G-CSF依赖性过程的方法,所述化合物通过调节G-CSF的水平或活性来上调或下调G-CSF的活性水平 SOCS分子如SOCS-3。 本发明化合物还可用于调节一系列G-CSF诱导的细胞反应,包括化疗或放疗后的嗜中性粒细胞回收,动员干细胞和祖细胞,治疗感染和治疗炎性病症。

    SYSTEM AND METHOD FOR PROVIDING AN ENHANCED FACILITY PLAN
    3.
    发明申请
    SYSTEM AND METHOD FOR PROVIDING AN ENHANCED FACILITY PLAN 有权
    用于提供增强设施计划的系统和方法

    公开(公告)号:US20130013269A1

    公开(公告)日:2013-01-10

    申请号:US13636671

    申请日:2011-03-23

    IPC分类号: G06F17/50

    CPC分类号: G06Q10/00

    摘要: A system and method for providing an enhanced facility plan includes receiving an asset list, electronic documents relating to one or more assets and an input image file for providing a visual representation of a facility plan including assets in the facility. The image file is scanned to automatically identify one or more asset tags having a corresponding asset tag entry in the asset list and for each identified asset tag, a position on the facility plan associated with the asset tag. A modified visual representation of the facility plan is provided as the enhanced facility plan, the modified visual representation including one or more added objects, each object having a relationship with an identified asset tag and having a location determined by the position associated with the related asset tag, wherein each object is selectable by a user to enable access to one or more of the electronic documents. The method may provide a convenient way of handing over information after construction of a facility.

    摘要翻译: 用于提供增强的设施计划的系统和方法包括接收资产列表,与一个或多个资产相关的电子文档和输入图像文件,用于提供包括设施中的资产的设施计划的视觉表示。 扫描图像文件以自动识别在资产列表中具有对应的资产标签条目的一个或多个资产标签,以及针对每个识别的资产标签,与资产标签相关联的设施计划上的位置。 提供设施计划的修改的视觉表示作为增强的设施计划,修改的视觉表示包括一个或多个添加的对象,每个对象与所标识的资产标签具有关系,并具有由与相关资产相关联的位置确定的位置 标签,其中每个对象可由用户选择以使得能够访问一个或多个电子文档。 该方法可以提供在设施建造之后交付信息的便利方式。

    CUSHIONING PAD FOR A HUMAN FOOT, AN INSOLE AND A SHOE COMPRISING SAID PAD, AND A METHOD FOR THE MANUFACTURE OF SAID INSOLE
    4.
    发明申请
    CUSHIONING PAD FOR A HUMAN FOOT, AN INSOLE AND A SHOE COMPRISING SAID PAD, AND A METHOD FOR THE MANUFACTURE OF SAID INSOLE 审中-公开
    用于人体脚垫的衬垫,包括垫的衬垫和鞋子以及制造工具的方法

    公开(公告)号:US20110232129A1

    公开(公告)日:2011-09-29

    申请号:US12303755

    申请日:2007-06-06

    IPC分类号: A43B7/14 A43B13/38 B29C45/00

    摘要: Pad for the ball regions of a human foot adapted to be placed in a shoe beneath a foot of a wearer of the shoe having a dimension in the heel to toe direction (X axis), a dimension in the outside to inside direction (Y axis) and a dimension in the down to up direction (Z axis) and comprising a front side surface and a back side surface, wherein the pad comprises at least two different zones, at least one first zone located on the X axis towards the toe direction and adapted for the support of the ball regions relating to at least three adjacent toes, in particular to all five toes of a human foot, and at least one adjacent second zone located on the X axis towards the heel direction, wherein the first zone has an average thickness greater than that of the second zone, wherein the second zone is tapered in the Z dimension in a toe to heel direction, wherein the front side surface of the first zone exhibits a pattern of protruding elements adapted for the massaging of the foot of the wearer, and wherein the first and second zones are comprising an elastomeric material.

    摘要翻译: 用于适于放置在鞋的穿戴者的脚下方的脚中的足部球的足球区域,其鞋跟区域具有鞋跟至脚趾方向(X轴)的尺寸,外侧至内侧方向(Y轴) )和从下到上的方向(Z轴)上的尺寸并且包括前侧表面和后侧表面,其中所述垫包括至少两个不同区域,至少一个位于X轴上的朝向脚趾方向的第一区域 并且适于支撑与至少三个相邻的脚趾相关的球区域,特别是对于人脚的所有五个趾部以及位于X轴上的脚跟方向的至少一个相邻的第二区域,其中第一区域具有 平均厚度大于所述第二区域的平均厚度,其中所述第二区域在所述Z尺寸中在趾部至鞋跟方向上呈锥形,其中所述第一区域的所述前侧表面呈现适于脚部按摩的突出元件的图案 的微量元素 并且其中第一和第二区域包括弹性体材料。

    Semiconductor Packages and Methods of Forming The Same
    6.
    发明申请
    Semiconductor Packages and Methods of Forming The Same 有权
    半导体封装及其形成方法

    公开(公告)号:US20130234283A1

    公开(公告)日:2013-09-12

    申请号:US13415556

    申请日:2012-03-08

    IPC分类号: H01L23/48 H01L21/78 H01L21/50

    摘要: In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The laminate substrate has a front side and an opposite back side. A plurality of first dies is placed within the first plurality of die openings. An integrated spacer is formed around each die of the plurality of first dies. The integrated spacer is disposed in gaps between the laminate substrate and an outer sidewall of each die of the plurality of first dies. The integrated spacer holds the die within the laminate substrate by partially extending over a portion of a top surface of each die of the plurality of first dies. Front side contacts are formed over the front side of the laminate substrate.

    摘要翻译: 在一个实施例中,制造半导体封装的方法包括在层叠基板上形成第一多个模具开口。 层叠基板具有前侧和相对的后侧。 多个第一模具被放置在第一多个模具开口内。 在多个第一管芯的每个管芯周围形成一个集成间隔件。 集成间隔件设置在层叠基板与多个第一管芯的每个管芯的外侧壁之间的间隙中。 集成间隔件通过部分延伸在多个第一管芯的每个管芯的顶表面的一部分上而将管芯保持在层压基板内。 前侧触点形成在层叠基板的前侧。

    TOE STRAP PROTECTOR, AND FOOTWEAR COMPRISING SAID PROTECTOR
    7.
    发明申请
    TOE STRAP PROTECTOR, AND FOOTWEAR COMPRISING SAID PROTECTOR 审中-公开
    鞋带保护器和包括防护器的鞋子

    公开(公告)号:US20080301977A1

    公开(公告)日:2008-12-11

    申请号:US11930256

    申请日:2007-10-31

    IPC分类号: A43B7/26 A61F13/06

    CPC分类号: A43B3/105

    摘要: The present invention relates to a protector for a toe strap of a footwear such, in particular in the form of a shoe, a sandal or a flip-flop, comprising a tube or a tube-like body with a first end and an opposite second end along its longitudinal axis, in particular in the form of a circumferential sleeve, which at least partially encloses a space, with a first opening at the first end and an opposite second opening at the second end for the at least partial inclusion of a toe strap, wherein an inner wall of the tube or tube-like body extends from the first to the second end and wherein an outer wall extends from the first to the second end, wherein the tube or tube-like body, in particular the circumferential sleeve, comprises a slit extending from the first end to the second end and from the outer to the inner wall so that the tube or tube-like body, in particular the circumferential sleeve, comprises adjacent longitudinal first and second areas, in particular contact areas which are facing each other and wherein the tube or tube-like body comprises an elastomeric material.Furthermore, the present invention relates to a footwear comprising said protector according to the present invention.

    摘要翻译: 本发明涉及一种用于鞋类的脚趾带的保护器,特别是靴子,凉鞋或触发器的形式,包括管或具有第一端和相对的第二端的管状主体 其特别是周向套筒的形式,其至少部分地包围空间,第一端部具有第一开口,在第二端处具有相对的第二开口,用于至少部分地包括脚趾 带,其中管或管状体的内壁从第一端延伸到第二端,并且其中外壁从第一端延伸到第二端,其中管或管状主体,特别是圆周套筒 包括从第一端延伸到第二端并从外部延伸到内壁的狭缝,使得管或管状体,特别是周向套筒包括相邻的纵向第一和第二区域,特别是接触区域 ar e彼此面对,并且其中管或管状主体包括弹性体材料。 此外,本发明涉及包括根据本发明的保护器的鞋类。

    SEALING PLUG
    8.
    发明申请
    SEALING PLUG 有权
    密封插头

    公开(公告)号:US20080111373A1

    公开(公告)日:2008-05-15

    申请号:US11564958

    申请日:2006-11-30

    IPC分类号: F16L25/00

    CPC分类号: F16L55/13

    摘要: A sealing plug for sealing a hole in a wall, which sealing plug is insertable into the hole by access from only one side thereof, which sealing plug comprises:a radially expandable body which is radially expandable by access thereto from only one end thereof, anda sealing cap which covers the other end of the expandable body and extends therefrom along the exterior of the length of the body, the sealing cap being of a material which is fluid resistant;whereby, when the sealing plug has been inserted in the hole and has been radially expanded so that at least part of the sealing cap adjacent the wall of the hole expands and engages therewith, the sealing cap is secured in the hole with the sealing cap sealing the plug body against access thereto from outside the cap.

    摘要翻译: 一种用于密封壁中的孔的密封塞,该密封塞通过仅从其一侧进入而可插入孔中,该密封塞包括:可径向扩张的主体,其可从其一端通过其径向扩张;以及 密封帽,其覆盖所述可膨胀体的另一端,并且沿着所述主体的长度的外部从所述密封帽延伸,所述密封帽是具有耐流体性的材料; 由此,当密封塞已经插入孔并且已经径向膨胀时,使得邻近孔壁的密封帽的至少一部分膨胀并与其接合,密封帽被固定在孔中,密封帽密封 所述塞体抵抗从所述帽外部进入的塞子。

    Three-dimensional tactile computer input device
    9.
    发明授权
    Three-dimensional tactile computer input device 失效
    三维触觉电脑输入装置

    公开(公告)号:US5396265A

    公开(公告)日:1995-03-07

    申请号:US583649

    申请日:1990-09-17

    IPC分类号: G06F3/033 G09G5/08 G06F15/00

    CPC分类号: G06F3/0346

    摘要: A tactile computer input device which simulates an object being designed is used with a computer aided design (CAD) system. The input device allows a user to manually manipulate the input device as if it were the object under design. A preferred embodiment is directed toward the design of sheet metal parts. The design begins with a virtual metal sheet which is then manipulated by a user through manual manipulation of the input device. Bending of the virtual object is accomplished by bending of the input device. Stretching and shrinking of the virtual object is accomplished by expanding and compressing the input device. Spatial orientation of the virtual object follows the spatial orientation of the input device by providing the input device with a Polhemus orientation sensor. Other functions for manipulating the virtual sheet metal object include cutting, embossing, and punching.

    摘要翻译: 用计算机辅助设计(CAD)系统使用模拟被设计物体的触觉计算机输入装置。 输入设备允许用户手动操作输入设备,就像它是设计中的对象一样。 优选的实施例是针对钣金零件的设计。 设计开始于虚拟金属板,然后由用户通过手动操纵输入装置来操纵。 通过弯曲输入装置来实现虚拟对象的弯曲。 通过扩展和压缩输入设备来实现虚拟对象的拉伸和收缩。 通过为输入设备提供Polhemus定向传感器,虚拟对象的空间定向遵循输入设备的空间取向。 用于操纵虚拟钣金物体的其他功能包括切割,压花和冲压。

    Semiconductor packages and methods of forming the same
    10.
    发明授权
    Semiconductor packages and methods of forming the same 有权
    半导体封装及其形成方法

    公开(公告)号:US09281260B2

    公开(公告)日:2016-03-08

    申请号:US13415556

    申请日:2012-03-08

    摘要: In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The laminate substrate has a front side and an opposite back side. A plurality of first dies is placed within the first plurality of die openings. An integrated spacer is formed around each die of the plurality of first dies. The integrated spacer is disposed in gaps between the laminate substrate and an outer sidewall of each die of the plurality of first dies. The integrated spacer holds the die within the laminate substrate by partially extending over a portion of a top surface of each die of the plurality of first dies. Front side contacts are formed over the front side of the laminate substrate.

    摘要翻译: 在一个实施例中,制造半导体封装的方法包括在层叠基板上形成第一多个裸片开口。 层叠基板具有前侧和相对的后侧。 多个第一模具被放置在第一多个模具开口内。 在多个第一管芯的每个管芯周围形成一个集成间隔件。 集成间隔件设置在层叠基板与多个第一管芯的每个管芯的外侧壁之间的间隙中。 集成间隔件通过部分延伸在多个第一管芯的每个管芯的顶表面的一部分上而将管芯保持在层压基板内。 前侧触点形成在层叠基板的前侧。