Extended life conditioning disk
    1.
    发明授权
    Extended life conditioning disk 失效
    延长寿命调节盘

    公开(公告)号:US07510463B2

    公开(公告)日:2009-03-31

    申请号:US11422753

    申请日:2006-06-07

    IPC分类号: B24B1/00 B24B21/18

    CPC分类号: B24B53/017 B24B53/12

    摘要: The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.

    摘要翻译: 本发明是一种用于延长研磨盘的寿命的装置和方法,用于在用于在生产集成的半导体晶片的表面中抛光和/或平面化半导体晶片的表面的抛光垫的化学机械平面化(CMP)中使用的抛光垫 电路。 本发明由包括多个磨料段的盘组成,每个研磨段围绕调节盘的公共旋转轴线彼此以切向和径向关系固定。 根据本发明,提供了用于将研磨段单独地或组合地移动到调节盘的活性研磨表面的平面内或外的装置。

    EXTENDED LIFE CONDITIONING DISK
    2.
    发明申请
    EXTENDED LIFE CONDITIONING DISK 失效
    延伸寿命调节盘

    公开(公告)号:US20070287367A1

    公开(公告)日:2007-12-13

    申请号:US11422753

    申请日:2006-06-07

    IPC分类号: B24D11/00

    CPC分类号: B24B53/017 B24B53/12

    摘要: The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.

    摘要翻译: 本发明是一种用于延长研磨盘的寿命的装置和方法,用于在用于在生产集成的半导体晶片的表面中抛光和/或平面化半导体晶片的表面的抛光垫的化学机械平面化(CMP)中使用的抛光垫 电路。 本发明由包括多个磨料段的盘组成,每个研磨段围绕调节盘的公共旋转轴线彼此以切向和径向关系固定。 根据本发明,提供了用于将研磨段单独地或组合地移动到调节盘的活性研磨表面的平面内或外的装置。