-
公开(公告)号:US07510463B2
公开(公告)日:2009-03-31
申请号:US11422753
申请日:2006-06-07
申请人: Ben Kim , Manoj Balachandran , James Aloysius Hagan , Deoram Persaud , Adam Daniel Ticknor , Wei-tsu Tseng
发明人: Ben Kim , Manoj Balachandran , James Aloysius Hagan , Deoram Persaud , Adam Daniel Ticknor , Wei-tsu Tseng
CPC分类号: B24B53/017 , B24B53/12
摘要: The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.
摘要翻译: 本发明是一种用于延长研磨盘的寿命的装置和方法,用于在用于在生产集成的半导体晶片的表面中抛光和/或平面化半导体晶片的表面的抛光垫的化学机械平面化(CMP)中使用的抛光垫 电路。 本发明由包括多个磨料段的盘组成,每个研磨段围绕调节盘的公共旋转轴线彼此以切向和径向关系固定。 根据本发明,提供了用于将研磨段单独地或组合地移动到调节盘的活性研磨表面的平面内或外的装置。
-
公开(公告)号:US20070287367A1
公开(公告)日:2007-12-13
申请号:US11422753
申请日:2006-06-07
申请人: Ben Kim , Manoj Balachandran , James Aloysius Hagan , Deoram Persaud , Adam Daniel Ticknor , Wei-tsu Tseng
发明人: Ben Kim , Manoj Balachandran , James Aloysius Hagan , Deoram Persaud , Adam Daniel Ticknor , Wei-tsu Tseng
IPC分类号: B24D11/00
CPC分类号: B24B53/017 , B24B53/12
摘要: The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.
摘要翻译: 本发明是一种用于延长研磨盘的寿命的装置和方法,用于在用于在生产集成的半导体晶片的表面中抛光和/或平面化半导体晶片的表面的抛光垫的化学机械平面化(CMP)中使用的抛光垫 电路。 本发明由包括多个磨料段的盘组成,每个研磨段围绕调节盘的公共旋转轴线彼此以切向和径向关系固定。 根据本发明,提供了用于将研磨段单独地或组合地移动到调节盘的活性研磨表面的平面内或外的装置。
-
3.
公开(公告)号:US20100249976A1
公开(公告)日:2010-09-30
申请号:US12415348
申请日:2009-03-31
申请人: Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slonim , Hong Lin , Fateh All Tipu , Adam Daniel Ticknor , Timothy M. McCormack
发明人: Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slonim , Hong Lin , Fateh All Tipu , Adam Daniel Ticknor , Timothy M. McCormack
IPC分类号: G06F17/00
CPC分类号: G05B23/0216 , G05B23/0229 , G05B2219/32191 , G05B2219/32194 , G05B2219/45031 , G05B2219/50065 , Y02P90/22 , Y02P90/86 , Y10T409/309408
摘要: A method and system for evaluating a performance of a semiconductor manufacturing tool while manufacturing microelectronic devices are disclosed. At least one report is generated based on executions of at least one statistical test. The report includes at least one heat map having rows that correspond to sensors, columns that correspond to trace data obtained during recipe steps, and cells at the intersection of the rows and the columns. At least one sensor in the tool obtains trace data of a recipe step while manufacturing at least one microelectronic device. A computing device analyzes the obtained trace data to determine a level of operational significance found in the data and assigns a score to the trace data that indicates a level of operational significance. Then, the computing device places the score in a corresponding cell of the heat map. A user uses the cell for evaluating the tool performance.
摘要翻译: 公开了一种用于在制造微电子器件的同时评估半导体制造工具的性能的方法和系统。 至少根据执行至少一项统计测试生成一份报告。 该报告包括至少一个具有与传感器对应的行的热图,对应于配方步骤期间获得的跟踪数据的列,以及行和列的交叉点处的单元格。 工具中至少有一个传感器获得配方步骤的痕迹数据,同时制造至少一个微电子器件。 计算设备分析所获得的跟踪数据以确定在数据中发现的操作意义的水平,并向指示操作意义水平的跟踪数据分配分数。 然后,计算设备将分数放置在热图的相应单元中。 用户使用单元格来评估刀具性能。
-
4.
公开(公告)号:US20130006406A1
公开(公告)日:2013-01-03
申请号:US13608032
申请日:2012-09-10
申请人: Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slomin , Hong Lin , Fateh Ali Tipu , Adam Daniel Ticknor , Timothy M. McCormack
发明人: Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slomin , Hong Lin , Fateh Ali Tipu , Adam Daniel Ticknor , Timothy M. McCormack
IPC分类号: G05B19/18
CPC分类号: G05B23/0216 , G05B23/0229 , G05B2219/32191 , G05B2219/32194 , G05B2219/45031 , G05B2219/50065 , Y02P90/22 , Y02P90/86 , Y10T409/309408
摘要: A method, a system and a computer program product suitable for use in a manufacturing environment comprising a multiplicity of nominally identical independent tools. A computing device generates a multi dimensional array of process trace data derived from at least one of the independent tools, wherein, the array includes data representing a first dimension comprising a list of steps in a manufacturing recipe and data representing a second dimension comprising a list of a set of sensors generating measurements from at least one of the independent tools. The computing device conducts an analysis on at least one preselected subset of the multi dimensional array for the purpose of evaluating at least one operating characteristic of at least one of the independent tools. The computing device presents results of the analysis via a set of hierarchically linked and browseable graphics.
摘要翻译: 一种适用于制造环境的方法,系统和计算机程序产品,包括多个名义上相同的独立工具。 计算设备生成从至少一个独立工具导出的过程跟踪数据的多维阵列,其中,所述阵列包括表示包括制造配方中的步骤列表的第一维度的数据和表示包括列表的第二维度的数据 一组传感器从至少一个独立工具产生测量值。 为了评估至少一个独立工具的至少一个操作特征,计算设备对多维阵列的至少一个预选子集进行分析。 计算设备通过一组分层链接和可浏览的图形呈现分析结果。
-
-
-