公开(公告)号：US20070287367A1

公开(公告)日：2007-12-13

申请号：US11422753

申请日：2006-06-07

申请人： Ben Kim ,  Manoj Balachandran ,  James Aloysius Hagan ,  Deoram Persaud ,  Adam Daniel Ticknor ,  Wei-tsu Tseng

发明人： Ben Kim ,  Manoj Balachandran ,  James Aloysius Hagan ,  Deoram Persaud ,  Adam Daniel Ticknor ,  Wei-tsu Tseng

IPC分类号： B24D11/00

CPC分类号： B24B53/017 ,  B24B53/12

摘要： The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.

摘要翻译： 本发明是一种用于延长研磨盘的寿命的装置和方法，用于在用于在生产集成的半导体晶片的表面中抛光和/或平面化半导体晶片的表面的抛光垫的化学机械平面化（CMP）中使用的抛光垫 电路。 本发明由包括多个磨料段的盘组成，每个研磨段围绕调节盘的公共旋转轴线彼此以切向和径向关系固定。 根据本发明，提供了用于将研磨段单独地或组合地移动到调节盘的活性研磨表面的平面内或外的装置。

公开(公告)号：US07510463B2

公开(公告)日：2009-03-31

申请号：US11422753

申请日：2006-06-07

申请人： Ben Kim ,  Manoj Balachandran ,  James Aloysius Hagan ,  Deoram Persaud ,  Adam Daniel Ticknor ,  Wei-tsu Tseng

发明人： Ben Kim ,  Manoj Balachandran ,  James Aloysius Hagan ,  Deoram Persaud ,  Adam Daniel Ticknor ,  Wei-tsu Tseng

IPC分类号： B24B1/00 ,  B24B21/18

CPC分类号： B24B53/017 ,  B24B53/12

摘要： The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.

摘要翻译： 本发明是一种用于延长研磨盘的寿命的装置和方法，用于在用于在生产集成的半导体晶片的表面中抛光和/或平面化半导体晶片的表面的抛光垫的化学机械平面化（CMP）中使用的抛光垫 电路。 本发明由包括多个磨料段的盘组成，每个研磨段围绕调节盘的公共旋转轴线彼此以切向和径向关系固定。 根据本发明，提供了用于将研磨段单独地或组合地移动到调节盘的活性研磨表面的平面内或外的装置。

公开(公告)号：US07556972B2

公开(公告)日：2009-07-07

申请号：US11626975

申请日：2007-01-25

申请人： Manoj Balachandran ,  James A. Hagan ,  Ben Kim ,  Deoram Persaud ,  Adam D. Ticknor ,  Wei-tsu Tseng

发明人： Manoj Balachandran ,  James A. Hagan ,  Ben Kim ,  Deoram Persaud ,  Adam D. Ticknor ,  Wei-tsu Tseng

IPC分类号： G01R31/26 ,  H01L21/00 ,  H01L21/302

CPC分类号： B24B57/02 ,  B24B37/04

摘要： Processes and apparatuses are disclosed for detecting and characterizing SiCOH-based dielectric materials during integrated circuit fabrication. The processes generally include chromatographically analyzing a fluid stream generated during a process employed for device fabrication, e.g., during a wet strip, a chemical mechanical planarization process and the like.

摘要翻译： 公开了用于在集成电路制造期间检测和表征SiCOH基介电材料的方法和装置。 这些方法通常包括色谱分析在用于器件制造的工艺中产生的流体流，例如在湿条，化学机械平面化工艺等期间。

公开(公告)号：US20080182335A1

公开(公告)日：2008-07-31

申请号：US11626975

申请日：2007-01-25

申请人： Manoj Balachandran ,  James A. Hagan ,  Ben Kim ,  Deoram Persaud ,  Adam D. Ticknor ,  Wei-Tsu Tseng

发明人： Manoj Balachandran ,  James A. Hagan ,  Ben Kim ,  Deoram Persaud ,  Adam D. Ticknor ,  Wei-Tsu Tseng

IPC分类号： H01L21/66 ,  B24B3/00

CPC分类号： B24B57/02 ,  B24B37/04

摘要： Processes and apparatuses are disclosed for detecting and characterizing SiCOH-based dielectric materials during integrated circuit fabrication. The processes generally include chromatographically analyzing a fluid stream generated during a process employed for device fabrication, e.g., during a wet strip, a chemical mechanical planarization process and the like.

摘要翻译： 公开了用于在集成电路制造期间检测和表征SiCOH基介电材料的方法和装置。 这些方法通常包括色谱分析在用于器件制造的工艺中产生的流体流，例如在湿条，化学机械平面化工艺等期间。

公开(公告)号：US20070190788A1

公开(公告)日：2007-08-16

申请号：US11276137

申请日：2006-02-15

申请人： Manoj Balachandran ,  James Hagan ,  Ben Kim ,  Deoram Persaud ,  Adam Ticknor ,  Wei-Tsu Tseng

发明人： Manoj Balachandran ,  James Hagan ,  Ben Kim ,  Deoram Persaud ,  Adam Ticknor ,  Wei-Tsu Tseng

IPC分类号： H01L21/302 ,  H01L21/461 ,  H01L21/311

CPC分类号： H01L21/02024 ,  B24B37/345

摘要： Reduction of a wafer removing force on a chemical mechanical planarization (CMP) tool that includes planarizing a wafer on a platen at a wafer/platen interface; applying carbonated water to the wafer/platen interface so as to reduce the removing force; and removing the wafer from the platen.

摘要翻译： 在化学机械平面化（CMP）工具上减少晶片去除力，其包括在晶片/压板界面处平台化压板上的晶片; 将碳酸水施加到晶片/压板界面，以减少去除力; 并从压板上移除晶片。