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公开(公告)号：US5468996A
公开(公告)日：1995-11-21
申请号：US218002
申请日：1994-03-25
CPC分类号： H05K1/141 , H05K3/365 , H05K1/0306 , H05K1/148 , H05K2201/10393 , H05K2201/1053 , H05K3/301 , H05K3/368
摘要： An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages are fully assembled. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.
摘要翻译： 一种电子封装，其包括基部构件和相关联的盖构件，其被设计用于定位在一起以压缩位于其中的至少两个电路化基板（例如，陶瓷基板和多个柔性基板）。 其中一个基板是基本上刚性的，并且在基座内以受保护的对齐方式被正确定位。 此外，柔性基底精确对准并且最初固定到刚性基底上，本发明还使用另外的弹性装置来在包装被完全组装时作用在每个柔性基底上。 盖子固定到基座上以实现内部元件的最终压缩。 该封装可以被定位在电耦合到另一个电路化的衬底（例如PCB）上。
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公开(公告)号：US5530291A
公开(公告)日：1996-06-25
申请号：US457915
申请日：1995-06-01
CPC分类号： H05K1/141 , H05K3/365 , H05K1/0306 , H05K1/148 , H05K2201/10393 , H05K2201/1053 , H05K3/301 , H05K3/368
摘要： An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages fully assemble. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.
摘要翻译： 一种电子封装，其包括基部构件和相关联的盖构件，其被设计用于定位在一起以压缩位于其中的至少两个电路化基板（例如，陶瓷基板和多个柔性基板）。 其中一个基板是基本上刚性的，并且在基座内以受保护的对齐方式被正确定位。 另外，柔性基板被精确对准并且初始地固定到刚性基板，本发明还使用另一个弹性装置来在封装完全组装时对每个柔性基板施加作用。 盖子固定到基座上以实现内部元件的最终压缩。 该封装可以被定位在电耦合到另一个电路化的衬底（例如PCB）上。
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公开(公告)号：US4863395A
公开(公告)日：1989-09-05
申请号：US297370
申请日：1989-01-17
IPC分类号： H01R13/629 , H01R12/89 , H01R13/639 , H01R24/00
CPC分类号： H01R12/89
摘要： A zero insertion force connector system with a top entry for improved interconnection with a component card and a component card positioner for providing an interconnectable structure that is useable with adjacent apparatus. The zero insertion force connector system includes a housing with a card guide channel having a top entry and a sliding cam system for interlocking the component card positioner and the component card in an improved manner. The component card positioner includes a card positioning structure with a tab cover structure and a card guide channel positioner for interaction with the sliding cam system of the zero insertion force connector system to properly interconnect the component card. The component card includes card contact tabs protected by a tab cover structure in the component card positioner and related to connector contacts positioned in the housing of the connector. The sliding cam system includes card retention lobes that mate with the lobe positioners in the card guide channel positioner for positioning the component card in an improved physical manner.
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