MODULE MOISTURE BARRIER
    1.
    发明申请
    MODULE MOISTURE BARRIER 审中-公开
    模块水分障碍

    公开(公告)号:US20110083734A1

    公开(公告)日:2011-04-14

    申请号:US12901188

    申请日:2010-10-08

    IPC分类号: H01L31/0224 H01L31/18

    摘要: A photovoltaic module may include a substrate; a semiconductor layer adjacent to the substrate; a lead foil adjacent to the semiconductor layer; a cover glass adjacent to the lead foil, where the cover glass includes a top surface, a bottom surface, and an opening, where the opening penetrates the top and bottom surfaces of the cover glass, and the opening includes an opening lateral dimension; and a barrier layer between the cover glass and the semiconductor layer, where the barrier layer includes a barrier lateral dimension, where the barrier lateral dimension is greater than the opening lateral dimension.

    摘要翻译: 光伏模块可以包括基板; 邻近衬底的半导体层; 邻近半导体层的铅箔; 与所述铅箔相邻的盖玻片,其中所述盖玻璃包括顶表面,底表面和开口,其中所述开口穿透所述盖玻璃的顶表面和底表面,并且所述开口包括开口横向尺寸; 以及所述覆盖玻璃和所述半导体层之间的阻挡层,其中所述阻挡层包括阻挡侧向尺寸,其中所述阻挡侧向尺寸大于所述开口横向尺寸。