摘要:
Embodiments of methods of making superhydrophobic structures comprise depositing a polymer mold onto a silicon surface comprising a plurality of microasperities, removing the polymer mold after the polymer mold has hardened, depositing a liquid epoxy resin into the polymer mold, forming a microstructure with a plurality of microasperities by separating the epoxy resin from the mold after the epoxy resin has solidified, and forming a superhydrophobic structure by depositing a plurality of alkane nanoasperities on the microstructure in the presence of solvent vapor.
摘要:
Embodiments of a superhydrophobic structure comprise a substrate and a hierarchical surface structure disposed on at least one surface of the substrate, wherein the hierarchical surface structure comprises a microstructure comprising a plurality of microasperities disposed in a spaced geometric pattern on at least one surface of the substrate. The fraction of the surface area of the substrate covered by the microasperities is from between about 0.1 to about 1. The hierarchical structure comprises a nanostructure comprising a plurality of nanoasperities disposed on at least one surface of the microstructure.
摘要:
Embodiments of methods of making superhydrophobic structures comprise depositing a polymer mold onto a silicon surface comprising a plurality of microasperities, removing the polymer mold after the polymer mold has hardened, depositing a liquid epoxy resin into the polymer mold, forming a microstructure with a plurality of microasperities by separating the epoxy resin from the mold after the epoxy resin has solidified, and forming a superhydrophobic structure by depositing a plurality of alkane nanoasperities on the microstructure in the presence of solvent vapor.
摘要:
A hydrophobic surface comprising a substrate and a roughened surface structure oriented on the substrate material is provided. The substrate comprises a surface, which is at least partially hydrophobic with a contact angle to liquid of 90° or greater. The roughened surface structure comprises a plurality of asperities arranged in a geometric pattern according to a roughness factor, wherein the roughness factor is characterized by a packing parameter p that equals the fraction of the surface area of the substrate covered by the asperities. The p parameter has a value from between about 0.5 to about 1.