公开(公告)号：US20200006246A1

公开(公告)日：2020-01-02

申请号：US16402522

申请日：2019-05-03

申请人： Jackson Chung Peng Kong ,  Bok Eng Cheah ,  Howard L. Heck ,  Seok Ling Lim ,  Jenny Shio Yin Ong

发明人： Jackson Chung Peng Kong ,  Bok Eng Cheah ,  Howard L. Heck ,  Seok Ling Lim ,  Jenny Shio Yin Ong

IPC分类号： H01L23/552 ,  H01L23/16 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10 ,  H01L21/48 ,  H01L25/00

摘要： A stiffener includes an integrated cable-header recess that couples a semiconductor package substrate flexible cable. The flexible cable connects to a device on a board without using interconnections that are arrayed through the board. A semiconductive die is coupled to the semiconductor package substrate and flexible cable through the cable-header recess.

公开(公告)号：US20210183779A1

公开(公告)日：2021-06-17

申请号：US17024182

申请日：2020-09-17

申请人： Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Jenny Shio Yin Ong ,  Seok Ling Lim

发明人： Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Jenny Shio Yin Ong ,  Seok Ling Lim

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L21/50

摘要： Disclosed embodiments include multi-level fan-out integrated-circuit package substrates that provide a low-loss path to active and passive devices, by shunting away from interconnects and inductive loops. The multi-level form factor of a molded mass, allows for the low-loss path.

公开(公告)号：US20210066185A1

公开(公告)日：2021-03-04

申请号：US16912619

申请日：2020-06-25

申请人： Seok Ling Lim ,  Jenny Shio Yin Ong ,  Bok Eng Cheah ,  Jackson Chung Peng Kong

发明人： Seok Ling Lim ,  Jenny Shio Yin Ong ,  Bok Eng Cheah ,  Jackson Chung Peng Kong

IPC分类号： H01L23/522 ,  H01L21/768 ,  H01L23/528

摘要： Disclosed embodiments include frame-array interconnects that have a ledge portion to accommodate a passive device. A seated passive device is between at least two frame-array interconnects for semiconductor package-integrated decoupling capacitors.

公开(公告)号：US20190006333A1

公开(公告)日：2019-01-03

申请号：US16017719

申请日：2018-06-25

申请人： Jenny Shio Yin Ong ,  Seok Ling Lim ,  Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Chin Lee Kuan

发明人： Jenny Shio Yin Ong ,  Seok Ling Lim ,  Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Chin Lee Kuan

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L21/48

摘要： A stiffener on a semiconductor package substrate includes a plurality of parts that are electrically coupled to the semiconductor package substrate on a die side. Both stiffener parts are electrically contacted through a passive device that is soldered between the two stiffener parts and by an electrically conductive adhesive that bonds a given stiffener part to the semiconductor package substrate. The passive device is embedded between two stiffener parts to create a smaller X-Y footprint as well as a lower Z-direction profile.

公开(公告)号：US20190181097A1

公开(公告)日：2019-06-13

申请号：US16018984

申请日：2018-06-26

申请人： Bok Eng Cheah ,  Seok Ling Lim ,  Jenny Shio Yin Ong ,  Jackson Chung Peng Kong

发明人： Bok Eng Cheah ,  Seok Ling Lim ,  Jenny Shio Yin Ong ,  Jackson Chung Peng Kong

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/16 ,  H01L25/10 ,  H01L25/00 ,  H01L25/18

摘要： A stiffener includes a through-stiffener interconnect that couples a semiconductor package substrate to a package-on-package device. The through-stiffener interconnect is insulated by a through-stiffener dielectric within a through-stiffener contact corridor. A semiconductive die is coupled to the semiconductor package substrate and to the package-on-package device.