公开(公告)号：US20200006246A1

公开(公告)日：2020-01-02

申请号：US16402522

申请日：2019-05-03

申请人： Jackson Chung Peng Kong ,  Bok Eng Cheah ,  Howard L. Heck ,  Seok Ling Lim ,  Jenny Shio Yin Ong

发明人： Jackson Chung Peng Kong ,  Bok Eng Cheah ,  Howard L. Heck ,  Seok Ling Lim ,  Jenny Shio Yin Ong

IPC分类号： H01L23/552 ,  H01L23/16 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10 ,  H01L21/48 ,  H01L25/00

摘要： A stiffener includes an integrated cable-header recess that couples a semiconductor package substrate flexible cable. The flexible cable connects to a device on a board without using interconnections that are arrayed through the board. A semiconductive die is coupled to the semiconductor package substrate and flexible cable through the cable-header recess.

公开(公告)号：US20210183779A1

公开(公告)日：2021-06-17

申请号：US17024182

申请日：2020-09-17

申请人： Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Jenny Shio Yin Ong ,  Seok Ling Lim

发明人： Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Jenny Shio Yin Ong ,  Seok Ling Lim

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L21/50

摘要： Disclosed embodiments include multi-level fan-out integrated-circuit package substrates that provide a low-loss path to active and passive devices, by shunting away from interconnects and inductive loops. The multi-level form factor of a molded mass, allows for the low-loss path.

公开(公告)号：US20210066185A1

公开(公告)日：2021-03-04

申请号：US16912619

申请日：2020-06-25

申请人： Seok Ling Lim ,  Jenny Shio Yin Ong ,  Bok Eng Cheah ,  Jackson Chung Peng Kong

发明人： Seok Ling Lim ,  Jenny Shio Yin Ong ,  Bok Eng Cheah ,  Jackson Chung Peng Kong

IPC分类号： H01L23/522 ,  H01L21/768 ,  H01L23/528

摘要： Disclosed embodiments include frame-array interconnects that have a ledge portion to accommodate a passive device. A seated passive device is between at least two frame-array interconnects for semiconductor package-integrated decoupling capacitors.

公开(公告)号：US20190181097A1

公开(公告)日：2019-06-13

申请号：US16018984

申请日：2018-06-26

申请人： Bok Eng Cheah ,  Seok Ling Lim ,  Jenny Shio Yin Ong ,  Jackson Chung Peng Kong

发明人： Bok Eng Cheah ,  Seok Ling Lim ,  Jenny Shio Yin Ong ,  Jackson Chung Peng Kong

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/16 ,  H01L25/10 ,  H01L25/00 ,  H01L25/18

摘要： A stiffener includes a through-stiffener interconnect that couples a semiconductor package substrate to a package-on-package device. The through-stiffener interconnect is insulated by a through-stiffener dielectric within a through-stiffener contact corridor. A semiconductive die is coupled to the semiconductor package substrate and to the package-on-package device.

公开(公告)号：US20190006333A1

公开(公告)日：2019-01-03

申请号：US16017719

申请日：2018-06-25

申请人： Jenny Shio Yin Ong ,  Seok Ling Lim ,  Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Chin Lee Kuan

发明人： Jenny Shio Yin Ong ,  Seok Ling Lim ,  Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Chin Lee Kuan

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L21/48

摘要： A stiffener on a semiconductor package substrate includes a plurality of parts that are electrically coupled to the semiconductor package substrate on a die side. Both stiffener parts are electrically contacted through a passive device that is soldered between the two stiffener parts and by an electrically conductive adhesive that bonds a given stiffener part to the semiconductor package substrate. The passive device is embedded between two stiffener parts to create a smaller X-Y footprint as well as a lower Z-direction profile.

公开(公告)号：US20150091180A1

公开(公告)日：2015-04-02

申请号：US14040642

申请日：2013-09-28

申请人： Jenny Shio Yin ONG ,  Choong Kooi Chee ,  Seok Ling Lim

发明人： Jenny Shio Yin ONG ,  Choong Kooi Chee ,  Seok Ling Lim

IPC分类号： H01L25/18 ,  H01L23/538 ,  H01L25/00

CPC分类号： H01L25/18 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/538 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/25 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/06183 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/2518 ,  H01L2224/73259 ,  H01L2224/9222 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/014

摘要： An apparatus including a die including a device side and an opposite backside, first contacts on the backside and a through vias from the device side to the first contacts and second contacts on the backside of the die or on at least two opposing sidewalls of the die; a secondary die coupled to the first plurality of contacts; and a carrier including carrier contact points operable for mounting the carrier to a substrate. A method including forming a first portion of a carrier adjacent a device side of a die and including carrier contact points operable for mounting the carrier to a substrate; and forming a second portion including second carrier contact points connected to contacts on the backside of the die or on at least two opposing sidewalls of the die; and coupling a secondary die to the second carrier contact points.

摘要翻译： 一种包括模具的设备，包括器件侧和相对的后侧，在后侧上的第一接触和从器件侧到第一接触件的通孔和在管芯的背面上的第二接触件或在管芯的至少两个相对的侧壁上 ; 耦合到所述第一多个触点的次模; 以及载体，其包括可操作用于将载体安装到基底的载体接触点。 一种方法，包括在模具的装置侧附近形成载体的第一部分，并且包括可操作以将载体安装到基底的载体接触点; 以及形成第二部分，所述第二部分包括连接到所述管芯的背面上的接触点或所述管芯的至少两个相对的侧壁上的第二载体接触点; 以及将次级管芯耦合到第二载体接触点。