摘要:
A switchable optical element is described, along with a method of manufacturing such an element. The switchable optical element (1) comprises a fluid chamber (2) including immiscible first and second bodies of fluid (20, 22) disposed relative to one another along an optical axis (A) of the element (1). The second body of fluid (22) is movable in a direction away from the optical axis (A) by electro-wetting action, giving the switchable optical element (1) a changeable transmissivity along the optical axis (A). The switchable optical element (1) is suitable for use as an optical attenuator, e.g. a shutter, filter or diaphragm, and can be conveniently used in place of mechanical alternatives in applications such as cameras, laser resonant cavities, projectors and devices for scanning optical record carriers.
摘要:
The invention relates to a camera module comprising a holder having a first end arranged for receiving light and a second end arranged for placing an image pickup module for picking up images. The camera module further comprises a lens or a system of lenses, having an optical axis arranged for forming an image on the image pickup module. Near the second end, the holder comprises means for aligning the image pickup module in a plane perpendicular to be optical axis. The aligning means are for instance formed by a recess in the inner wall of the holder near the second end. The image pickup module is placed within the recess substantially without play. This method of aligning the image pickup module simplifies the manufacture of the camera module.
摘要:
The invention relates to a semiconductor device (10) comprising a semiconductor element (1), particularly a solid-state image sensor (1), comprising a semiconductor body (11) of which one surface comprises an optically active part (1A) and an optically inactive part (1B) within which electrical connection regions (2) of the optoelectronic semiconductor element (1) are present, while a body (3) is present above the optically active area (1A) of the surface of the semiconductor body (11) comprising an optical component (3B). According to the invention the body (3) comprises an optically transparent foil (3) which is present on the optically active part (1A) of the surface of the semiconductor body (11) and which is attached thereto with an optically transparent adhesive layer (4) and in which the optical component (3B) is formed. The device (10) is very stable, compact and easy to manufacture, that is to say in batches. For example a component (3B) such as a lens (3B) may easily be formed by pressing a suitably formed die (13) into the foil (3). A method according to the invention for manufacturing the device according to the invention is cost-effective and easy.
摘要:
The present invention relates to a sensor device for sensing an image of an object, wherein a detection means (14) for detecting radiation received from the object is supported by a light-emitting semiconductor means (12) for emitting radiation towards said object during a predetermined operation period of the detection means (14). The detection means (14) can be operated even at low light intensity conditions and at a low power consumption. The detection means (14) may be a two-side illuminated detection means, wherein one side is supported by the light-emitting semiconductor means (12) and the other side is a back-etched side with increased sensitivity. A cheap and very small multi-purpose camera or sensor module can thereby be provided.
摘要:
The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis through the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.
摘要:
The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.
摘要:
The invention relates to a camera module 100. The camera module 100 comprises a holder 102, which provides a light-conducting channel 122. Within the light-conducting channel 122 a lens 120 having an optical axis 106 is present. A solid-state image sensor 113 is present near an end 128 of the light-conducting channel 122. The image sensor 113 is provided with an image section 114, which is oriented perpendicularly to the optical axis 106. Near the end 128 of the light-conducting channel, forming part of the holder 102, aligning means 131 are present for aligning the image section 114 with the optical axis 106. In one embodiment of the camera module 100, the inner wall 130 of the holder 102 is substantially rectangular, seen in cross-sectional view in a direction perpendicular to the optical axis 106. Bulges 131 present near the corners of the rectangle form the aligning means. The bulges 131 are provided with L-shaped recesses 129 in which the lateral surfaces 127 of the solid-state image sensor 113 are placed substantially without play. This method of aligning the image section 114 with the optical axis 106 simplifies the manufacture of the camera module 100.