公开(公告)号：US20160230055A1

公开(公告)日：2016-08-11

申请号：US15134517

申请日：2016-04-21

Applicant: Bostik, Inc.

Inventor： Richard Hamann ,  Lianne Rachow

IPC: C09J157/02 ,  B32B7/12 ,  A61F13/515 ,  B32B27/12 ,  B32B27/32 ,  A61F13/49 ,  C09J11/08 ,  B32B5/02

CPC classification number: C09J157/02 ,  A61F13/49009 ,  A61F13/515 ,  B32B5/022 ,  B32B7/12 ,  B32B27/12 ,  B32B27/32 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2307/31 ,  B32B2307/51 ,  B32B2439/00 ,  B32B2519/00 ,  B32B2555/02 ,  C08L23/142 ,  C08L91/06 ,  C09J11/08 ,  C09J123/12

Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; about 5% to about 50% of a plasticizer; about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).

Abstract translation: 一种用于多孔基材的热熔粘合剂，其中该热熔粘合剂具有约10％至约70％重量的DSC熔点低于100℃的聚丙烯均聚物; 约10％至约60％的具有环球软化点的第一增粘树脂约95℃至约140℃; 约0％至约65％的与第一增粘树脂不同的第二增粘树脂; 约5％至约50％的增塑剂; 约1％至约40％重量的二级聚合物，其为半结晶聚合物或蜡，其熔融焓大于30焦耳/克; 约0.1％至约5％的稳定剂或抗氧化剂; 其中组分总计为组合物重量的100％，组合物的粘度在163℃（325°F）下等于或小于约20,000厘泊（cP）。

公开(公告)号：US09334431B2

公开(公告)日：2016-05-10

申请号：US14284381

申请日：2014-05-21

Applicant: Bostik, Inc.

Inventor： Richard Hamann ,  Lianne Rachow

IPC: C09J157/02 ,  C09J123/12 ,  C08L91/06

CPC classification number: C09J157/02 ,  A61F13/49009 ,  A61F13/515 ,  B32B5/022 ,  B32B7/12 ,  B32B27/12 ,  B32B27/32 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2307/31 ,  B32B2307/51 ,  B32B2439/00 ,  B32B2519/00 ,  B32B2555/02 ,  C08L23/142 ,  C08L91/06 ,  C09J11/08 ,  C09J123/12

Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; d) about 5% to about 50% of a plasticizer; e) about 1% to about 40% by weight of a secondary polymer which is either a semi-crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; f) about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).

Abstract translation: 一种用于多孔基材的热熔粘合剂，其中该热熔粘合剂具有a）约10％至约70％重量的DSC熔点低于100℃的聚丙烯均聚物; b）约10％至约60％的具有约95℃至约140℃的环球软化点的第一增粘树脂; c）与第一增粘树脂不同的约0％至约65％的第二增粘树脂; d）约5％至约50％的增塑剂; e）约1％至约40％重量的二级聚合物，其为半结晶聚合物或具有大于30焦耳/克的熔解焓的蜡; f）约0.1％至约5％的稳定剂或抗氧化剂; 其中组分总计为组合物重量的100％，组合物的粘度在163℃（325°F）下等于或小于约20,000厘泊（cP）。

公开(公告)号：US20140350155A1

公开(公告)日：2014-11-27

申请号：US14284381

申请日：2014-05-21

Applicant: Bostik, Inc.

Inventor： Richard Hamann ,  Lianne Rachow

IPC: C09J157/02

CPC classification number: C09J157/02 ,  A61F13/49009 ,  A61F13/515 ,  B32B5/022 ,  B32B7/12 ,  B32B27/12 ,  B32B27/32 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2307/31 ,  B32B2307/51 ,  B32B2439/00 ,  B32B2519/00 ,  B32B2555/02 ,  C08L23/142 ,  C08L91/06 ,  C09J11/08 ,  C09J123/12

Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; d) about 5% to about 50% of a plasticizer; e) about 1% to about 40% by weight of a secondary polymer which is either a semi-crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; f) about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).

Abstract translation: 一种用于多孔基材的热熔粘合剂，其中该热熔粘合剂具有a）约10％至约70％重量的DSC熔点低于100℃的聚丙烯均聚物; b）约10％至约60％的具有约95℃至约140℃的环球软化点的第一增粘树脂; c）与第一增粘树脂不同的约0％至约65％的第二增粘树脂; d）约5％至约50％的增塑剂; e）约1％至约40％重量的二级聚合物，其为半结晶聚合物或具有大于30焦耳/克的熔解焓的蜡; f）约0.1％至约5％的稳定剂或抗氧化剂; 其中组分总计为组合物重量的100％，组合物的粘度在163℃（325°F）下等于或小于约20,000厘泊（cP）。

公开(公告)号：US09783712B2

公开(公告)日：2017-10-10

申请号：US15134517

申请日：2016-04-21

Applicant: Bostik, Inc.

Inventor： Richard Hamann ,  Lianne Rachow

IPC: C09J157/02 ,  C09J123/12 ,  C09J11/08 ,  A61F13/49 ,  A61F13/51 ,  B32B5/02 ,  A61F13/515 ,  B32B7/12 ,  B32B27/12 ,  B32B27/32

CPC classification number: C09J157/02 ,  A61F13/49009 ,  A61F13/515 ,  B32B5/022 ,  B32B7/12 ,  B32B27/12 ,  B32B27/32 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2307/31 ,  B32B2307/51 ,  B32B2439/00 ,  B32B2519/00 ,  B32B2555/02 ,  C08L23/142 ,  C08L91/06 ,  C09J11/08 ,  C09J123/12

Abstract: A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; about 5% to about 50% of a plasticizer; about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).