公开(公告)号：US20220080717A1

公开(公告)日：2022-03-17

申请号：US17417840

申请日：2019-12-19

Applicant: Bostik, Inc.

Inventor： Russell P. STUCZYNSKI ,  Katsuyuki TANAKA ,  Xin YE ,  Zhenjun ZHANG

IPC: B32B37/12 ,  B32B41/00 ,  B32B5/02 ,  B32B15/14 ,  B32B38/00

Abstract: Build-up of adhesive on process equipment is reduced or even eliminated by increasing the running temperature of process equipment used to guide substrates as they are conveyed along a system used to apply adhesive and form laminates. Preferably, the process equipment is heated to a temperature of at least about 5° C., preferably at least about 10° C., and most preferably at least about 15° C., above the crossover temperature of the adhesive, and at most about 60° C., preferably at most about 50° C., and most preferably at most about 45° C., above the crossover temperature. This method is particularly beneficial when using hot melt adhesives to form laminates with permeable substrates, such as low basis weight nonwovens, for use in disposable absorbent articles. A system for applying a hot melt adhesive to a substrate comprises a heater for providing heat to the process equipment and, optionally, a chiller for cooling the process equipment.