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公开(公告)号:US20220221394A1
公开(公告)日:2022-07-14
申请号:US17610489
申请日:2020-05-13
Applicant: Bostik Inc.
Inventor: Luke A. BURKHOLDER , Russell P. STUCZYNSKI , Kayla VAN DYKE , Gautier HOURIEZ
IPC: G01N19/04
Abstract: A system for testing an adhesive used for an adhesive-backed hygiene article, such as a feminine care pad, a breast pad, or certain adult incontinence pads, comprises first and second substrates defining a gap for positioning a weight which, by using a force measurement system, is caused to move over the substrate and to detach the adhesive-backed hygiene article from the cloth material. A method utilizes the system and measures the force as the weight moves after the weight contacts the adhesive-backed hygiene article. The force measured is reflective of the entire system, both the force required to cause the adhesive between the article and the cloth material to fail and for the article to bunch on itself. Depending on the specific test, one or two weights may be used.
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公开(公告)号:US20220080717A1
公开(公告)日:2022-03-17
申请号:US17417840
申请日:2019-12-19
Applicant: Bostik, Inc.
Inventor: Russell P. STUCZYNSKI , Katsuyuki TANAKA , Xin YE , Zhenjun ZHANG
Abstract: Build-up of adhesive on process equipment is reduced or even eliminated by increasing the running temperature of process equipment used to guide substrates as they are conveyed along a system used to apply adhesive and form laminates. Preferably, the process equipment is heated to a temperature of at least about 5° C., preferably at least about 10° C., and most preferably at least about 15° C., above the crossover temperature of the adhesive, and at most about 60° C., preferably at most about 50° C., and most preferably at most about 45° C., above the crossover temperature. This method is particularly beneficial when using hot melt adhesives to form laminates with permeable substrates, such as low basis weight nonwovens, for use in disposable absorbent articles. A system for applying a hot melt adhesive to a substrate comprises a heater for providing heat to the process equipment and, optionally, a chiller for cooling the process equipment.
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公开(公告)号:US20190202188A1
公开(公告)日:2019-07-04
申请号:US16322682
申请日:2017-02-08
Applicant: BOSTIK, INC.
Inventor: Steven Daniel GRAY , Ronald Frank GRAF , David Frederic FREUND , Miao HU , Russell P. STUCZYNSKI , Richard Edward HAMANN , Jeffery Thomas OLSON
IPC: B32B37/00 , B32B37/12 , B32B7/12 , B32B5/02 , B32B27/32 , B32B38/00 , B32B37/06 , B32B37/02 , B32B37/18
Abstract: Adhesive bleed-through of substrates and build-up of adhesive on process equipment can be reduced or even fully eliminated by increasing the running temperature of circumferential rolls (e.g., nip rollers or idlers) used to compress and adhesively bond the substrates of a laminate structure together, as opposed to the usual cooling of the nip rollers. This method is particularly beneficial when using polyolefin-based hot melt adhesives to form laminates with permeable substrates, such as low basis weight nonwovens, for use in disposable absorbent articles. The method can be used to make a range of laminated structures, such as bi-laminates and tri-laminates.
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