公开(公告)号：US5527999A

公开(公告)日：1996-06-18

申请号：US391740

申请日：1995-02-21

申请人： Bradley R. Knigga ,  Christine A. Paszkiet

发明人： Bradley R. Knigga ,  Christine A. Paszkiet

IPC分类号： H01L23/538 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/46 ,  H05K1/00

CPC分类号： H05K1/0265 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K1/092 ,  H05K1/115 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K3/4664

摘要： A multilayer circuit is provided characterized by a multilayer conductor structure. The multilayer conductor structure is composed of at least two conductor layers, with each adjacent layer being separated by a dielectric material in the form of one or more dielectric layers. The multilayer circuit further includes electrically conductive members or features for electrically interconnecting the conductor layers at two or more locations along the lengths of the conductor layers. As a result, portions of the conductor layers between two or more locations are electrically in parallel with each other, such that the multilayer conductor is characterized by an electrical resistance between the locations which is less than the electrical resistance of the individual conductor layers between the locations. The multilayer conductor is therefore characterized by an augmented current-carrying capacity as compared to a single layer conductor of the same length and width.

摘要翻译： 提供了一种多层电路，其特征在于多层导体结构。 多层导体结构由至少两个导体层组成，每个相邻层由一个或多个介电层形式的电介质材料隔开。 多层电路还包括导电构件或特征，用于沿着导体层的长度在两个或更多个位置处电连接导体层。 结果，两个或更多个位置之间的导体层的部分彼此电并联，使得多层导体的特征在于小于单个导体层之间的电阻的位置之间的电阻 位置。 因此，与具有相同长度和宽度的单层导体相比，多层导体的特征在于增大的载流能力。