公开(公告)号：US10331032B2

公开(公告)日：2019-06-25

申请号：US13867815

申请日：2013-04-22

Applicant: Brewer Science Inc.

Inventor： Joyce Lowes ,  Jinhua Dai ,  Alice Guerrero

IPC: G03F7/09 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  G03F7/095 ,  H01L21/266

Abstract: Photosensitive, developer-soluble bottom anti-reflective coatings are described. Compositions and methods of forming the same are also disclosed along with resulting microelectronic structures. The anti-reflective compositions comprise a multi-functional epoxy compound having multiple epoxy moieties pendant therefrom and one or more crosslinkable chromophores bonded thereto. The compounds are dispersed or dissolved in a solvent system with a vinyl ether crosslinker and can be used to create crosslinkable and de-crosslinkable coatings for microelectronics fabrication.

公开(公告)号：US20130280656A1

公开(公告)日：2013-10-24

申请号：US13867815

申请日：2013-04-22

Applicant: BREWER SCIENCE INC.

Inventor： Joyce Lowes ,  Jinhua Dai ,  Alice Guerrero

IPC: G03F7/09

CPC classification number: G03F7/091 ,  G03F7/095 ,  G03F7/20 ,  G03F7/322 ,  G03F7/40 ,  H01L21/266

Abstract: Photosensitive, developer-soluble bottom anti-reflective coatings are described. Compositions and methods of forming the same are also disclosed along with resulting microelectronic structures. The anti-reflective compositions comprise a multi-functional epoxy compound having multiple epoxy moieties pendant therefrom and one or more crosslinkable chromophores bonded thereto. The compounds are dispersed or dissolved in a solvent system with a vinyl ether crosslinker and can be used to create crosslinkable and de-crosslinkable coatings for microelectronics fabrication.

Abstract translation: 描述了感光，显影剂可溶的底部抗反射涂层。 还公开了组合物及其形成方法以及所得的微电子结构。 抗反射组合物包含具有多个环氧基部分的多官能环氧化合物，和与其结合的一个或多个可交联的发色团。 化合物分散或溶解在具有乙烯基醚交联剂的溶剂体系中，并且可以用于产生用于微电子制造的可交联和去交联的涂层。

公开(公告)号：US20220262755A1

公开(公告)日：2022-08-18

申请号：US17672020

申请日：2022-02-15

Applicant: Brewer Science, Inc.

Inventor： Chia-Hsin Lee ,  Alice Guerrero ,  Arthur O. Southard ,  Chen-Yu Wu ,  Xiao Liu

IPC: H01L23/00

Abstract: Achieving homogeneous and heterogeneous integration for 2.5D and 3D integrated circuit, chip-to-wafer, chip-to-substrate, or wafer-to-wafer bonding is an essential technology. The landing wafer or substrate is bonded with a carrier by using a temporary bonding material before thinning the landing wafer to the desired thickness. Upon completion of redistribution layer formation, Cu pad formation, or other backside processing, dies or wafers with through-silicon vias are stacked onto the landing substrate before molding and singulation. As the landing wafer usually has interconnection metals in the bond line, and those interconnection metals are typically made from lead-free solder alloys, deformation of those solder alloys during thermocompression bonding becomes an issue for manufacturers. To address this issue, a polymeric material with desired strengths is coated on the device wafer to form a conformal protective layer on top of solder alloys, thus enabling temporary bonding and debonding processes.