公开(公告)号：US07017428B2

公开(公告)日：2006-03-28

申请号：US10728544

申请日：2003-12-04

申请人： Byoung-jun Min ,  Jeong-ho Bang ,  Hyun-seop Shim ,  Hyo-geun Chae

发明人： Byoung-jun Min ,  Jeong-ho Bang ,  Hyun-seop Shim ,  Hyo-geun Chae

IPC分类号： G01M19/00

CPC分类号： G01R31/2893 ,  G01R1/0483 ,  G01R31/2806

摘要： A test kit for a semiconductor package and a method for testing the semiconductor package using the same are provided. The test kit for a semiconductor package includes a pick-and-place tool for picking up and loading/unloading the semiconductor package, a head assembly having a package guider and a socket guider, and a socket which is positioned under the head assembly. The socket guider performs a pre-alignment function for a correct operation of the package guider, before the package guider starts operating. The package guider aligns the semiconductor package.

摘要翻译： 提供了一种用于半导体封装的测试套件以及使用其的半导体封装测试方法。 用于半导体封装的测试套件包括用于拾取和加载/卸载半导体封装的拾取和放置工具，具有封装导向器和插座导向器的头部组件以及位于头部组件下方的插座。 套件导向器在包导向器开始操作之前执行用于正确操作包导向器的预对准功能。 封装导向器对准半导体封装。

公开(公告)号：US06462534B2

公开(公告)日：2002-10-08

申请号：US09805212

申请日：2001-03-14

申请人： Seong-goo Kang ,  Byoung-jun Min ,  Hyo-geun Chae ,  Jeong-ho Bang

发明人： Seong-goo Kang ,  Byoung-jun Min ,  Hyo-geun Chae ,  Jeong-ho Bang

IPC分类号： G01R3102

CPC分类号： G01R31/2867 ,  G01R1/0408 ,  H01L2224/75 ,  H01L2224/81

摘要： A loader of semiconductor package burn-in test equipment allows a test socket to be commonly used for semiconductor packages of all sizes. The loader includes a vacuum suction head for picking semiconductor packages to be tested, and a package guider for ensuring that semiconductor packages of any size will be aligned with the test socket. As the semiconductor package is positioned over the test socket by the vacuum suction head of the loader, guide surfaces of the package guider are brought inwardly into guide positions at which the surfaces extend just beneath the vacuum suction head. Any semiconductor package that is not in alignment with the test socket while being held by the vacuum suction head is guided by the guides surfaces into alignment once the vacuum suction is turned off and the package falls from the vacuum suction head. Thus, the package guider serves as an adaptor, eliminating the need for several test sockets having respective adaptors for different sizes of semiconductor packages.

摘要翻译： 半导体封装老化测试设备的装载机允许测试插座常用于各种尺寸的半导体封装。 装载机包括用于拾取待测试的半导体封装的真空吸头，以及用于确保任何尺寸的半导体封装将与测试插座对准的封装导向器。 当半导体封装通过装载机的真空吸头位于测试插座上方时，封装引导件的引导表面向内进入引导位置，在该位置处表面正好在真空抽吸头的正下方延伸。 在真空抽吸被关闭并且包装从真空抽吸头落下的情况下，由真空吸头保持的不与测试插座对准的任何半导体封装被引导面对引导。 因此，封装导向器用作适配器，消除了对具有用于不同尺寸的半导体封装的相应适配器的多个测试插座的需要。