Test kit for semiconductor package and method for testing semiconductor package using the same
    1.
    发明授权
    Test kit for semiconductor package and method for testing semiconductor package using the same 失效
    用于半导体封装的测试套件及使用其的半导体封装测试方法

    公开(公告)号:US07017428B2

    公开(公告)日:2006-03-28

    申请号:US10728544

    申请日:2003-12-04

    IPC分类号: G01M19/00

    摘要: A test kit for a semiconductor package and a method for testing the semiconductor package using the same are provided. The test kit for a semiconductor package includes a pick-and-place tool for picking up and loading/unloading the semiconductor package, a head assembly having a package guider and a socket guider, and a socket which is positioned under the head assembly. The socket guider performs a pre-alignment function for a correct operation of the package guider, before the package guider starts operating. The package guider aligns the semiconductor package.

    摘要翻译: 提供了一种用于半导体封装的测试套件以及使用其的半导体封装测试方法。 用于半导体封装的测试套件包括用于拾取和加载/卸载半导体封装的拾取和放置工具,具有封装导向器和插座导向器的头部组件以及位于头部组件下方的插座。 套件导向器在包导向器开始操作之前执行用于正确操作包导向器的预对准功能。 封装导向器对准半导体封装。

    Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith
    2.
    发明授权
    Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith 失效
    半导体封装测试设备,包括具有封装导向器的装载器和将半导体封装装载到与之对齐的测试插座上的方法

    公开(公告)号:US06462534B2

    公开(公告)日:2002-10-08

    申请号:US09805212

    申请日:2001-03-14

    IPC分类号: G01R3102

    摘要: A loader of semiconductor package burn-in test equipment allows a test socket to be commonly used for semiconductor packages of all sizes. The loader includes a vacuum suction head for picking semiconductor packages to be tested, and a package guider for ensuring that semiconductor packages of any size will be aligned with the test socket. As the semiconductor package is positioned over the test socket by the vacuum suction head of the loader, guide surfaces of the package guider are brought inwardly into guide positions at which the surfaces extend just beneath the vacuum suction head. Any semiconductor package that is not in alignment with the test socket while being held by the vacuum suction head is guided by the guides surfaces into alignment once the vacuum suction is turned off and the package falls from the vacuum suction head. Thus, the package guider serves as an adaptor, eliminating the need for several test sockets having respective adaptors for different sizes of semiconductor packages.

    摘要翻译: 半导体封装老化测试设备的装载机允许测试插座常用于各种尺寸的半导体封装。 装载机包括用于拾取待测试的半导体封装的真空吸头,以及用于确保任何尺寸的半导体封装将与测试插座对准的封装导向器。 当半导体封装通过装载机的真空吸头位于测试插座上方时,封装引导件的引导表面向内进入引导位置,在该位置处表面正好在真空抽吸头的正下方延伸。 在真空抽吸被关闭并且包装从真空抽吸头落下的情况下,由真空吸头保持的不与测试插座对准的任何半导体封装被引导面对引导。 因此,封装导向器用作适配器,消除了对具有用于不同尺寸的半导体封装的相应适配器的多个测试插座的需要。

    Socket including pressure conductive rubber and mesh for testing of ball grid array package
    3.
    发明授权
    Socket including pressure conductive rubber and mesh for testing of ball grid array package 有权
    插座包括压力导电橡胶和网格用于球栅阵列封装的测试

    公开(公告)号:US06489790B1

    公开(公告)日:2002-12-03

    申请号:US09519720

    申请日:2000-03-07

    IPC分类号: G01R3102

    CPC分类号: G01R1/073 G01R1/0483

    摘要: A socket for testing a BGA package capable of avoiding problems like deformation of external terminals of the BGA package or failing to detect a defective BGA package and a test method using the socket are provided. The socket for testing a BGA package connects solder balls (or solder bumps) as external terminals of the BGA package via a mesh, a pressure conductive rubber (PCR) as a middle connection unit, and a channel connection means of a socket board. A plane board having POGO pins or a printed circuit pattern can be used for the channel connection means.

    摘要翻译: 提供一种用于测试BGA封装的插座,其能够避免诸如BGA封装的外部端子的变​​形或不能检测到有缺陷的BGA封装的问题以及使用插座的测试方法。 用于测试BGA封装的插座通过网格,作为中间连接单元的压力导电橡胶(PCR)和插座板的通道连接装置将焊球(或焊料凸块)作为BGA封装的外部端子连接。 具有POGO引脚或印刷电路图案的平板可用于通道连接装置。

    Test method for high speed memory devices in which limit conditions for the clock are defined
    4.
    发明授权
    Test method for high speed memory devices in which limit conditions for the clock are defined 失效
    定义时钟限制条件的高速存储器件的测试方法

    公开(公告)号:US06201746B1

    公开(公告)日:2001-03-13

    申请号:US09107947

    申请日:1998-06-30

    IPC分类号: G11C700

    CPC分类号: G11C29/14

    摘要: When high speed memory devices are tested using a tester having a lower operating frequency than the operational speed of the memory device, limit conditions for the tester signals are required to prevent the interference between the tester and device signals. The present invention provides the limit conditions for the shift and strobe signal. The strobe signal is delivered to comparators with a delivery delay time defining the dead time zone. The shift signal controls the data path of the device to and from a driver and a comparator. When the strobe signal is within the present test cycle, the shift signal of a read cycle must be activated at the same time or earlier than the activation time of the WE/ signal of the next write cycle and the shift signal of a write cycle must start at the same time or earlier than the activation time of the OE/ signal of the next read cycle. When the strobe signal is outside of the test cycle, the shift signal must meet prescribed maximum and minimum timing conditions.

    摘要翻译: 当使用具有比存储器件的操作速度更低的工作频率的测试仪测试高速存储器件时,需要测试仪信号的限制条件以防止测试仪和器件信号之间的干扰。 本发明提供了移位和选通信号的限制条件。 选通信号通过定义死区时间的传送延迟时间传送给比较器。 移位信号控制设备到驱动器和比较器的数据路径。 当选通信号在当前测试周期内时,读周期的移位信号必须与下一个写周期的WE /信号的激活时间相同或早于激活时间,并且写周期的移位信号必须 同时或早于下一个读取周期的OE /信号的激活时间启动。 当选通信号超出测试周期时,移位信号必须满足规定的最大和最小定时条件。

    Plasma display panel apparatus and method of protecting an over current thereof
    5.
    发明授权
    Plasma display panel apparatus and method of protecting an over current thereof 失效
    等离子显示面板装置及其过电流保护方法

    公开(公告)号:US06710550B2

    公开(公告)日:2004-03-23

    申请号:US10183526

    申请日:2002-06-28

    申请人: Jeong-ho Bang

    发明人: Jeong-ho Bang

    IPC分类号: G09G310

    摘要: A plasma display panel apparatus includes a pair of discharge sustaining electrodes, a panel capacitor to supply charged voltage alternately to each electrode of the pair of discharge sustaining electrodes, a switching device for discharge that is turned on when the panel capacitor is discharged, to thereby pass through discharged current of the panel capacitor, a current sensing part to sense the current passed through by the switching device for discharge, and an over-current controlling part that turns off the switching device for discharge when the current sensed in the current sensing part is at or above a predetermined reference value. With this configuration, the plasma display panel apparatus protects the switching device from over-current generated during an abnormal driving of the discharge sustaining electrode driving circuit.

    摘要翻译: 等离子体显示面板装置包括一对放电维持电极,对一对放电维持电极的每个电极交替地提供充电电压的面板电容器,当面板电容器放电时导通的用于放电的开关装置,从而 通过面板电容器的放电电流,电流检测部分,用于感测由开关装置进行放电的电流;以及过电流控制部,当在电流感测部分中感测到的电流时,切断装置进行放电 处于或高于预定的参考值。 利用这种配置,等离子体显示面板装置保护开关装置免于在放电维持电极驱动电路的异常驱动期间产生的过电流。

    Handoff system and method between different kinds of devices, SIP server and operational method of SIP server
    6.
    发明授权
    Handoff system and method between different kinds of devices, SIP server and operational method of SIP server 有权
    各种设备之间的切换系统和方法,SIP服务器和SIP服务器的操作方法

    公开(公告)号:US08018899B2

    公开(公告)日:2011-09-13

    申请号:US11355173

    申请日:2006-02-16

    IPC分类号: H04W4/00

    摘要: A handoff system and method between different kinds of devices, an SIP server and an application method of the SIP server applied thereto. The handoff system between different kinds of devices includes a plurality of devices; a SIP server which requests a routing path update when a handoff request signal is input from a source device among the plurality devices, and getting a target device to participate in a current session; and a gateway which updates a predetermined routing path when a request signal for the routing path update is input, and transmitting data to the source device and the target device via the updated routing path.

    摘要翻译: 不同种类的设备之间的切换系统和方法,SIP服务器和应用于其中的SIP服务器的应用方法。 不同种类的设备之间的切换系统包括多个设备; SIP服务器,当从所述多个设备中的源设备输入切换请求信号时请求路由路径更新,并且使目标设备参与当前会话; 以及当输入用于路由路径更新的请求信号时更新预定路由路径的网关,以及经由更新的路由路径将数据发送到源设备和目标设备。

    Fuse box including make-link and redundant address decoder having the same, and method for repairing defective memory cell
    7.
    发明授权
    Fuse box including make-link and redundant address decoder having the same, and method for repairing defective memory cell 失效
    包括制造链路和具有相同功能的冗余地址解码器的保险丝盒以及用于修复有缺陷的存储器单元的方法

    公开(公告)号:US06850450B2

    公开(公告)日:2005-02-01

    申请号:US10075568

    申请日:2002-02-13

    IPC分类号: G11C29/00 G11C11/00

    CPC分类号: G11C29/785 G11C29/781

    摘要: A fuse box including make-links and a redundancy address decoder including the fuse box are provided. It is preferable that the fuse box includes a plurality of make-links for programming an address of a defective normal memory cell with an address of a corresponding redundant memory cell, and the address is a row address or a column address. The redundant address decoder includes a fuse box having a plurality of make-links for decoding an address of a defect cell and a redundant word line selection circuit for selecting a word line of a redundant cell corresponding to the address of the defect cell in response to a signal output from the fuse box.

    摘要翻译: 提供包括制造链路的保险丝盒和包括保险丝盒的冗余地址解码器。 优选地,保险丝盒包括多个制造链接,用于通过对应的冗余存储器单元的地址对有缺陷的正常存储器单元的地址进行编程,并且该地址是行地址或列地址。 冗余地址解码器包括具有用于对缺陷单元的地址进行解码的多个制造链路的熔丝盒和冗余字线选择电路,用于响应于对应于缺陷单元的地址的冗余单元的字线进行选择 从保险丝盒输出的信号。

    Handoff system and method between different kinds of devices, SIP server and operational method of SIP server
    8.
    发明申请
    Handoff system and method between different kinds of devices, SIP server and operational method of SIP server 有权
    各种设备之间的切换系统和方法,SIP服务器和SIP服务器的操作方法

    公开(公告)号:US20060187943A1

    公开(公告)日:2006-08-24

    申请号:US11355173

    申请日:2006-02-16

    IPC分类号: H04L12/56

    摘要: A handoff system and method between different kinds of devices, an SIP server and an application method of the SIP server applied thereto. The handoff system between different kinds of devices includes a plurality of devices; a SIP server which requests a routing path update when a handoff request signal is input from a source device among the plurality devices, and getting a target device to participate in a current session; and a gateway which updates a predetermined routing path when a request signal for the routing path update is input, and transmitting data to the source device and the target device via the updated routing path.

    摘要翻译: 不同种类的设备之间的切换系统和方法,SIP服务器和应用于其中的SIP服务器的应用方法。 不同种类的设备之间的切换系统包括多个设备; SIP服务器,当从所述多个设备中的源设备输入切换请求信号时请求路由路径更新,并且使目标设备参与当前会话; 以及当输入用于路由路径更新的请求信号时更新预定路由路径的网关,以及经由更新的路由路径将数据发送到源设备和目标设备。

    Method for testing a remnant batch of semiconductor devices
    10.
    发明授权
    Method for testing a remnant batch of semiconductor devices 有权
    用于测试残留批次的半导体器件的方法

    公开(公告)号:US06922050B2

    公开(公告)日:2005-07-26

    申请号:US10835143

    申请日:2004-04-28

    CPC分类号: G01R31/01

    摘要: A method for testing semiconductor devices includes loading a customer tray with semiconductor devices to be tested. Groups of devices are transferred from the customer tray to buffer trays for testing. The number of devices in the customer tray is checked after each transfer. If the customer tray is empty, the number of semiconductor devices in the buffer trays is counted and compared with the number of semiconductor devices that can be tested simultaneously, typically either 64 or 128. If the number of semiconductor devices in the buffer trays is greater than the tester capacity, the semiconductor devices in at least one buffer tray are tested. If the number of semiconductor devices in the buffer trays is smaller than the tester capacity, semiconductor devices that were determined to be low quality in a prior test are loaded into a buffer tray, thus testing both untested and low quality devices together.

    摘要翻译: 一种用于测试半导体器件的方法包括:将客户托盘加载到待测试的半导体器件上。 设备组从客户托盘传输到缓冲盘进行测试。 客户托盘中的设备数量在每次传输后都会被检查。 如果客户托盘为空,则对缓冲托盘中的半导体器件的数量进行计数,并与可同时测试的半导体器件的数量进行比较,通常为64或128.如果缓冲托盘中的半导体器件的数量较大 比测试器的容量,测试至少一个缓冲盘中的半导体器件。 如果缓冲盘中的半导体器件的数量小于测试器容量,则在先前测试中被确定为低质量的半导体器件被加载到缓冲托盘中,从而同时测试未测试的和低质量的器件。