公开(公告)号：US08182263B2

公开(公告)日：2012-05-22

申请号：US12293464

申请日：2007-03-14

申请人： Byung Gil Choi

发明人： Byung Gil Choi

IPC分类号： F27B9/14

CPC分类号： F27B9/045 ,  C21D1/00 ,  C21D9/00 ,  C21D9/0062 ,  F27B9/02 ,  F27B9/028 ,  F27B9/2407 ,  F27B9/36 ,  F27B9/40 ,  F27D19/00 ,  F27D21/00

摘要： The invention provides a heat treatment apparatus, in which an intake valve (91a) is mounted on an ambient gas feed pipe (91) connected to a heating chamber (12), an exhaust valve (131a) is mounted on an exhaust pipe (131), and a pressure sensor (150) is provided on the heating chamber (12). Through the control of a control unit (80) connected to the pressure sensor (150), to the intake valve (91a) and to the exhaust valve (131a), the intake valve (91a) and the exhaust valve (131a) are opened or closed, thus supplying ambient gas into the heating chamber (12) or exhausting ambient gas from the cooling chamber (13) depending on an internal pressure of the heating chamber (12). Thus, the amount of ambient gas used in heat treating workpieces (1) is minimized and thus operational costs are reduced. It is possible to prevent accidents such as gas explosions as well as to reduce environmental contamination caused by the combustion of ambient gas.

摘要翻译： 本发明提供一种热处理装置，其中进气阀（91a）安装在与加热室（12）连接的环境气体供给管（91）上，排气阀（131a）安装在排气管（131） ），并且在加热室（12）上设置有压力传感器（150）。 通过控制连接到压力传感器（150）的控制单元（80）到进气门（91a）和排气阀（131a），打开进气门（91a）和排气阀（131a） 或关闭，从而根据加热室（12）的内部压力将环境气体供应到加热室（12）中或从冷却室（13）排出环境气体。 因此，热处理工件（1）中使用的环境气体的量最小化，从而降低了操作成本。 可以防止气体爆炸等事故，并减少环境气体燃烧引起的环境污染。

公开(公告)号：US20090269713A1

公开(公告)日：2009-10-29

申请号：US12293464

申请日：2007-03-14

申请人： Byung Gil Choi

发明人： Byung Gil Choi

IPC分类号： F27D19/00 ,  F27D7/04

CPC分类号： F27B9/045 ,  C21D1/00 ,  C21D9/00 ,  C21D9/0062 ,  F27B9/02 ,  F27B9/028 ,  F27B9/2407 ,  F27B9/36 ,  F27B9/40 ,  F27D19/00 ,  F27D21/00

摘要： The invention provides a heat treatment apparatus, in which an intake valve (91a) is mounted on an ambient gas feed pipe (91) connected to a heating chamber (12), an exhaust valve (131a) is mounted on an exhaust pipe (131), and a pressure sensor (150) is provided on the heating chamber (12). Through the control of a control unit (80) connected to the pressure sensor (150), to the intake valve (91a) and to the exhaust valve (131a), the intake valve (91a) and the exhaust valve (131a) are opened or closed, thus supplying ambient gas into the heating chamber (12) or exhausting ambient gas from the cooling chamber (13) depending on an internal pressure of the heating chamber (12). Thus, the amount of ambient gas used in heat treating workpieces (1) is minimized and thus operational costs are reduced. It is possible to prevent accidents such as gas explosions as well as to reduce environmental contamination caused by the combustion of ambient gas.

摘要翻译： 本发明提供一种热处理装置，其中进气阀（91a）安装在与加热室（12）连接的环境气体供给管（91）上，排气阀（131a）安装在排气管（131） ），并且在加热室（12）上设置有压力传感器（150）。 通过控制连接到压力传感器（150）的控制单元（80）到进气门（91a）和排气阀（131a），打开进气门（91a）和排气阀（131a） 或关闭，从而根据加热室（12）的内部压力将环境气体供应到加热室（12）中或从冷却室（13）排出环境气体。 因此，热处理工件（1）中使用的环境气体的量最小化，从而降低了操作成本。 可以防止气体爆炸等事故，并减少环境气体燃烧引起的环境污染。

公开(公告)号：US07978539B2

公开(公告)日：2011-07-12

申请号：US12292891

申请日：2008-11-28

申请人： Kwang Jin Lee ,  Byung Gil Choi

发明人： Kwang Jin Lee ,  Byung Gil Choi

IPC分类号： G11C7/22

CPC分类号： G11C8/10 ,  G11C8/12 ,  G11C13/00 ,  G11C13/0004 ,  G11C13/0023 ,  G11C13/0026 ,  G11C13/004 ,  G11C13/0061 ,  G11C13/0069 ,  G11C15/00 ,  G11C15/046 ,  G11C2013/0076

摘要： In one embodiment, the semiconductor device includes a non-volatile memory cell array. Memory cells of the non-volatile memory cell array are resistance based, and each memory cell has a resistance that changes over time after data is written into the memory cell. A write address buffer is configured to store write addresses associated with data being written into the non-volatile memory cell array, and a read unit is configured to perform a read operation to read data from the non-volatile memory cell array. The read unit is configured to control a read current applied to the non-volatile memory cell array during the read operation based on whether a read address matches one of the stored write addresses and at least one indication of settling time of the data being written into the non-volatile memory cell array.

摘要翻译： 在一个实施例中，半导体器件包括非易失性存储单元阵列。 非易失性存储单元阵列的存储单元是基于电阻的，并且每个存储单元具有在将数据写入存储单元之后随时间而改变的电阻。 写地址缓冲器被配置为存储与被写入非易失性存储单元阵列的数据相关联的写地址，并且读单元被配置为执行读操作以从非易失性存储单元阵列读取数据。 读取单元被配置为基于读取地址是否匹配所存储的写入地址之一和写入的数据的建立时间的至少一个指示来控制在读取操作期间施加到非易失性存储器单元阵列的读取电流 非易失性存储单元阵列。

公开(公告)号：US20090237978A1

公开(公告)日：2009-09-24

申请号：US12292891

申请日：2008-11-28

申请人： Kwang Jin Lee ,  Byung Gil Choi

发明人： Kwang Jin Lee ,  Byung Gil Choi

IPC分类号： G11C7/10 ,  G11C11/21

CPC分类号： G11C8/10 ,  G11C8/12 ,  G11C13/00 ,  G11C13/0004 ,  G11C13/0023 ,  G11C13/0026 ,  G11C13/004 ,  G11C13/0061 ,  G11C13/0069 ,  G11C15/00 ,  G11C15/046 ,  G11C2013/0076

摘要： In one embodiment, the semiconductor device includes a non-volatile memory cell array. Memory cells of the non-volatile memory cell array are resistance based, and each memory cell has a resistance that changes over time after data is written into the memory cell. A write address buffer is configured to store write addresses associated with data being written into the non-volatile memory cell array, and a read unit is configured to perform a read operation to read data from the non-volatile memory cell array. The read unit is configured to control a read current applied to the non-volatile memory cell array during the read operation based on whether a read address matches one of the stored write addresses and at least one indication of settling time of the data being written into the non-volatile memory cell array.

摘要翻译： 在一个实施例中，半导体器件包括非易失性存储单元阵列。 非易失性存储单元阵列的存储单元是基于电阻的，并且每个存储单元具有在将数据写入存储单元之后随时间而改变的电阻。 写地址缓冲器被配置为存储与被写入非易失性存储单元阵列的数据相关联的写地址，并且读单元被配置为执行读操作以从非易失性存储单元阵列读取数据。 读取单元被配置为基于读取地址是否匹配所存储的写入地址之一和写入的数据的建立时间的至少一个指示来控制在读取操作期间施加到非易失性存储器单元阵列的读取电流 非易失性存储单元阵列。