公开(公告)号：US20180023197A1

公开(公告)日：2018-01-25

申请号：US15549471

申请日：2016-01-25

申请人： C. Uyemura & Co., Ltd.

发明人： Yoshikazu SAIJO ,  Hisamitsu YAMAMOTO ,  Tetsuji ISHIDA ,  Takuya KOMEDA ,  Masayuki UTSUMI

IPC分类号： C23C18/20 ,  H05K3/38

CPC分类号： C23C18/2066 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/38 ,  H05K3/18 ,  H05K3/181 ,  H05K3/381 ,  H05K2203/0776 ,  H05K2203/0793

摘要： The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.

公开(公告)号：US20150072070A1

公开(公告)日：2015-03-12

申请号：US14478332

申请日：2014-09-05

申请人： C. Uyemura & Co., Ltd

发明人： Yoshikazu SAIJO ,  Hisamitsu YAMAMOTO ,  Masayuki UTSUMI ,  Takuya OKAMACHI ,  Takuya KOMEDA

IPC分类号： H05K3/38 ,  H05K3/18

CPC分类号： H05K3/381 ,  C23C18/16 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  H05K3/181 ,  H05K2203/0776 ,  H05K2203/0783 ,  H05K2203/0789

摘要： A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.

摘要翻译： 提供了一种用于化学镀的预处理剂，其包括：氟化合物; 表面活性剂; 和至少一种溶剂，其选自式为C 4 H 9 - （OC 2 H 4）m -OH的乙烯基乙二醇丁醚，其中m为1至4的整数，以及式C 4 H 9 - （OC 3 H 6）n的丙烯基二醇丁基醚 -OH，其中n是1至4的整数。还提供了用于预处理用于印刷线路板的基板的方法以及印刷线路板的制造方法，其中包括使用无电化学处理剂 如上所述。