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公开(公告)号：US20210047734A1
公开(公告)日：2021-02-18
申请号：US17089113
申请日：2020-11-04
摘要： A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid contains a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y=an integer of 1 to 3).
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公开(公告)号：US20140053774A1
公开(公告)日：2014-02-27
申请号：US13951947
申请日：2013-07-26
CPC分类号： B05C3/09 , B05B16/20 , B05C3/00 , B05C5/002 , B05C11/11 , B08B3/041 , C23C18/1619 , Y10T137/8593
摘要： A tank body 100 includes a liquid receiving part 2 for receiving processing solution Q applied to a plate-like work 10 and a liquid retaining part 4 for retaining liquids to be applied to the plate-like work 10 and a liquid outflowing part 6 for causing a flow of the processing solution Q which is spilled out of the liquid retaining part 4 and traveled down toward the plate-like work 10, wherein a tip 6a of the liquid outflowing part 6 is projected from a connecting part 5 connecting to the liquid retaining part 4 (or the liquid receiving part 2).
摘要翻译： 罐体100包括用于接收施加到板状工件10的处理液Q的液体接收部分2和用于保持施加到板状工件10的液体的液体保持部分4和用于引起 处理液Q从液体保持部分4溢出并朝着板状工件10向下移动，其中液体流出部分6的尖端6a从连接到液体保持部分的液体保持部分 部分4（或液体接收部分2）。
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公开(公告)号：US20190264329A1
公开(公告)日：2019-08-29
申请号：US16318253
申请日：2017-06-19
摘要： A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid comprises: a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y=an integer of 1 to 3).
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公开(公告)号：US20170253975A1
公开(公告)日：2017-09-07
申请号：US15511063
申请日：2015-09-14
CPC分类号： C23C18/52 , C23C2/003 , C23C2/02 , C23C2/04 , C23C18/1603 , C23C18/1605 , C23C18/1619 , C23C18/1633 , C23C18/208 , C23C18/31 , C23C18/36 , C23C18/405 , H05K3/107 , H05K3/187 , H05K3/422
摘要： Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.
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公开(公告)号：US20240279814A1
公开(公告)日：2024-08-22
申请号：US18404207
申请日：2024-01-04
CPC分类号： C23C18/1683 , C23C18/1628 , C23C18/1637 , C23C18/168 , C23C18/1689 , C23C18/32 , C23C18/38 , G01K3/14 , G01N21/31
摘要： The present invention provides an apparatus capable of measuring a deposition status, such as a plating deposition rate, even during a plating process in a plating tank. A controller 20 controls a plating solution introduction mechanism 6 to introduce a plating solution in a plating tank 2 into a reaction container 4. By the introduced plating solution, a metal film is deposited on a deposition member 12 provided in the reaction container 4. Next, metal film dissolution control means 24 of the controller 20 controls an etching solution introduction mechanism 8 to introduce an etching solution into the reaction container 4 instead of the plating solution. The introduced etching solution dissolves the metal film deposited on the deposition member 12. A measurement equipment 10 measures a metal concentration-related value (metal concentration or a metal concentration-related value) of the post-processing etching solution in which the metal film is dissolved. Estimation means 26 of the controller 20 estimates the deposition status, such as the plating deposition rate, in the plating tank 2 on the basis of the metal concentration-related value measured by the measurement equipment 10.
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公开(公告)号：US20210262096A1
公开(公告)日：2021-08-26
申请号：US17254741
申请日：2020-02-13
IPC分类号： C23C18/40
摘要： An electroless copper plating bath is an electroless copper plating bath with a pH of 5 to 10 containing a hydrazine compound as a reducing agent and not containing formaldehyde. The electroless copper plating bath comprises at least: an amine-based complexing agent or an amine compound; and an aminocarboxylic acid-based complexing agent.
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公开(公告)号：US20180087140A1
公开(公告)日：2018-03-29
申请号：US15600928
申请日：2017-05-22
摘要： A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrate 54 is sandwiched and held by a clip 52 of a hanger 50. A pipe 56 as a treatment solution releasing section is provided on each side of the substrate 54 that is held by the hanger 50. This pipe 56 is provided with a hole 58 from which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate 54, reaches a lower portion thereof, is circulated by a pump 60, and is released from the pipe 56 again.
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8.发明申请公开(公告)号：US20180023197A1
公开(公告)日：2018-01-25
申请号：US15549471
申请日：2016-01-25
CPC分类号： C23C18/2066 , C23C18/2086 , C23C18/22 , C23C18/38 , H05K3/18 , H05K3/181 , H05K3/381 , H05K2203/0776 , H05K2203/0793
摘要： The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.
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9.发明申请PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PRODUCTION OF PRINTED WIRING BOARD USING SAME 有权用于电镀的预处理剂，使用相同的印刷电路板的预处理和生产公开(公告)号：US20150072070A1
公开(公告)日：2015-03-12
申请号：US14478332
申请日：2014-09-05
CPC分类号： H05K3/381 , C23C18/16 , C23C18/1653 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/38 , H05K3/181 , H05K2203/0776 , H05K2203/0783 , H05K2203/0789
摘要： A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.
摘要翻译： 提供了一种用于化学镀的预处理剂，其包括：氟化合物; 表面活性剂; 和至少一种溶剂，其选自式为C 4 H 9 - （OC 2 H 4）m -OH的乙烯基乙二醇丁醚，其中m为1至4的整数，以及式C 4 H 9 - （OC 3 H 6）n的丙烯基二醇丁基醚 -OH，其中n是1至4的整数。还提供了用于预处理用于印刷线路板的基板的方法以及印刷线路板的制造方法，其中包括使用无电化学处理剂 如上所述。
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公开(公告)号：US20210289637A1
公开(公告)日：2021-09-16
申请号：US16348296
申请日：2017-09-20
摘要： The present invention provides a method for producing a novel printed wiring board having much higher adhesion between a filler-containing insulating resin substrate and a plating film. The method comprises the steps of: subjecting a filler-containing insulating resin substrate to a swelling treatment; a roughening treatment; a reduction treatment; and electroless plating, wherein the filler-containing insulating resin substrate after the reduction treatment is treated with a first treating solution and a second treating solution, and then is subjected to the electroless plating, wherein the first treating solution has a pH of 7 or higher and comprises: at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH, where m=an integer of 1 to 4, n=an integer of 1 to 4, and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH, where x=an integer of 1 to 4, y=an integer of 1 to 3, and wherein the second treating solution has a pH of 7.0 or higher and comprises an amine-based silane coupling agent.
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