公开(公告)号：US20130244432A1

公开(公告)日：2013-09-19

申请号：US13799680

申请日：2013-03-13

Applicant: CABOT MICROELECTRONICS CORPORATION

Inventor： Brian REISS ,  Michael WILLHOFF ,  Daniel MATEJA

IPC: H01L21/306

CPC classification number: H01L21/30625 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053

Abstract: The invention relates to a chemical-mechanical polishing composition comprising a ceria abrasive, cations of one or more lanthanide metals, one or more nonionic polymers, water, and optionally one or more additives. The invention further relates to a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises one or more of silicon oxide, silicon nitride, and polysilicon.

Abstract translation: 本发明涉及一种化学机械抛光组合物，其包含二氧化铈磨料，一种或多种镧系元素金属的阳离子，一种或多种非离子聚合物，水和任选的一种或多种添加剂。 本发明还涉及用本发明的化学 - 机械抛光组合物对衬底进行化学机械抛光的方法。 通常，衬底包括氧化硅，氮化硅和多晶硅中的一种或多种。