公开(公告)号：US20150334259A1

公开(公告)日：2015-11-19

申请号：US14698238

申请日：2015-04-28

Applicant: CANON COMPONENTS, INC

Inventor： Akio MIHARA

IPC: H04N1/00 ,  H05K1/18 ,  H05K1/03 ,  H04N1/191 ,  H05K1/11

CPC classification number: H05K3/284 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H04N1/00557 ,  H04N1/00559 ,  H04N1/191 ,  H05K1/0313 ,  H05K1/111 ,  H05K1/181 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09418 ,  H05K2201/10151 ,  H05K2201/10636 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A circuit board includes: a printed board including SWB pads for wire bonding and lands; image sensor ICs mounted on the printed board by a thermosetting adhesive and including FWB pads for wire bonding to be electrically connected to the SWB pads by wire bonding; and surface-mount elements mounted on the lands by soldering, wherein the surface-mount elements and the lands are connected by solders including bromine-containing flux, and coating films are formed on surfaces of the solders to prevent attachment of bromine to the SWB pads and the FWB pads.

Abstract translation: 电路板包括：印刷板，其包括用于引线接合和焊盘的SWB焊盘; 图像传感器IC通过热固性粘合剂安装在印刷板上，并且包括用于引线接合的FWB焊盘，以通过引线接合电连接到SWB焊盘; 和通过焊接安装在焊盘上的表面安装元件，其中表面安装元件和焊盘由包括含溴助焊剂的焊料连接，并且在焊料的表面上形成涂膜以防止溴附着到SWB焊盘 和FWB垫。

公开(公告)号：US20130163057A1

公开(公告)日：2013-06-27

申请号：US13723467

申请日：2012-12-21

Applicant: Canon Components, Inc.

Inventor： Akio MIHARA

IPC: H04N1/028

CPC classification number: H04N1/028 ,  H04N1/1931 ,  H04N1/1932 ,  H04N1/1933 ,  H04N1/1934 ,  H04N1/1935 ,  H04N1/1938

Abstract: In an image sensor unit, sensor substrates include a plurality of edges arranged on a substrate holder in a longitudinal direction at predetermined intervals, sensor chips at the edges are mounted beyond the edges, and the substrate holder includes positioning portions that position the sensor chips.

Abstract translation: 在图像传感器单元中，传感器基板包括以预定间隔沿长度方向布置在基板保持器上的多个边缘，边缘处的传感器芯片安装在边缘之外，并且基板保持器包括定位传感器芯片的定位部分。