公开(公告)号：US20140376061A1

公开(公告)日：2014-12-25

申请号：US14283309

申请日：2014-05-21

Applicant: CANON COMPONENTS, INC.

Inventor： Junichi KATO ,  Takashi CHIBA ,  Junya KINOSHITA

IPC: H04N1/00

CPC classification number: H04N1/00798 ,  H04N1/192 ,  H04N1/1931 ,  H04N1/1934 ,  H04N1/1935 ,  H04N1/1938

Abstract: A plurality of edges of sensor substrates are connected in a longitudinal direction in a sensor substrate unit. Farthest tips of sensor chips at the edges of the sensor substrates are positioned inside of farthest edges of the edges in the longitudinal direction. The edges of the connected sensor substrates overlap each other in a thickness direction of the sensor substrates in plan view.

Abstract translation: 传感器基板的多个边缘在传感器基板单元中沿纵向连接。 在传感器基板的边缘处的传感器芯片的最远端位于纵向方向上边缘的最远边缘的内侧。 连接的传感器基板的边缘在平面图中在传感器基板的厚度方向上彼此重叠。

公开(公告)号：US20160330342A1

公开(公告)日：2016-11-10

申请号：US15105724

申请日：2014-09-10

Applicant: CANON COMPONENTS, INC.

Inventor： Junya KINOSHITA ,  Takashi CHIBA ,  Yuusuke KATO ,  Noboru TATSUISHI

IPC: H04N1/03 ,  H05K1/11 ,  B41J2/01 ,  H05K1/18

CPC classification number: H04N1/03 ,  B41J2/01 ,  H04N2201/0094 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/0047 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09381 ,  H05K2201/10106 ,  H05K2203/167

Abstract: A sensor substrate (13) includes an insertion opening (131) for inserting a light source substrate (32), and a plurality of pads (111) that are arranged along the insertion opening (131). The plurality of pads (111) and an external connection terminal are connected through a solder, and a tip of the pads (111) reaches an opening edge of the insertion opening (131).

Abstract translation: 传感器基板（13）包括用于插入光源基板（32）的插入开口（131）和沿插入开口（131）布置的多个焊盘（111）。 多个焊盘（111）和外部连接端子通过焊料连接，并且焊盘（111）的尖端到达插入开口（131）的开口边缘。

公开(公告)号：US20150110382A1

公开(公告)日：2015-04-23

申请号：US14519762

申请日：2014-10-21

Applicant: CANON COMPONENTS, INC.

Inventor： Shuuichi SHIMODA ,  Junya KINOSHITA ,  Yoshio KUREISHI ,  Ryoki MATSUI ,  Hidemasa YOSHIDA ,  Yoshihiko TSUMEKAWA ,  Hidehisa TAKAHASHI ,  Akifumi FUJIWARA ,  Suguru TASHIRO ,  Takashi CHIBA

IPC: G01J1/44 ,  G07D7/20 ,  G07D7/12 ,  G01N21/86

CPC classification number: G07D7/121 ,  G01J3/0208 ,  G01J3/0216 ,  G01J3/0291 ,  G01J3/10 ,  G01N21/86 ,  G01N21/8806 ,  G01N21/8914 ,  G01N2021/8663 ,  G07D7/202

Abstract: An image sensor unit includes: a plurality of light sources each including an LED chip; a plurality of light guides that are arranged in parallel to face incident surfaces on one side in a longitudinal direction for each of the plurality of light sources and that guide light from the plurality of light sources to a bill; an image sensor that converts light from the bill to an electric signal; a sensor substrate for mounting the image sensor; and a circuit board that is provided with the plurality of light sources on a same mounting surface and that is arranged on the sensor substrate on one side in the longitudinal direction of the plurality of light guides, wherein the sensor substrate includes a connection hole on one side in the longitudinal direction of the sensor substrate, and the circuit board is connected to the sensor substrate by connecting a connecting portion including a plurality of external connection pads to the connection hole.

Abstract translation: 图像传感器单元包括：多个光源，每个光源包括LED芯片; 多个光导件，其平行布置成面对每个所述多个光源的长度方向的一侧的入射面，并且将来自所述多个光源的光引导到纸币; 将来自纸币的光转换成电信号的图像传感器; 用于安装图像传感器的传感器基板; 以及电路板，其在同一安装面上设置有多个光源，并且在所述多个光导的长度方向上的一侧配置在所述传感器基板上，其中，所述传感器基板在一个上形成有连接孔 并且通过将包括多个外部连接焊盘的连接部分连接到连接孔而将电路板连接到传感器基板。