利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.013 秒)

    ELECTRONIC DEVICE
    1.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240332474A1

    公开(公告)日：2024-10-03

    申请号：US18586524

    申请日：2024-02-25

    申请人： CARUX TECHNOLOGY PTE. LTD.

    发明人： Chao-Sen Yang ,  Chao-Chin Sung ,  Chueh-Yuan Nien ,  Chien-Tzu Chu

    IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/124

    摘要： An electronic device is provided. The electronic device includes a substrate, a first conductive layer, an insulating layer, a second conductive layer, and an electronic element. The first conductive layer is disposed on the substrate and includes a first power line. The insulating layer is disposed on the first power line and has a first opening. The first opening exposes the first power line. The second conductive layer is disposed on the insulating layer. The second conductive layer includes a first conductive element. At least a portion of the first conductive element is disposed in the first opening and electrically connected to the first power line. The electronic element is disposed on the insulating layer and electrically connected to the first power line. The electronic device in the embodiments of the disclosure may reduce the resistivity of metal wires, improve the problem of IR drop, or uniform the emitted light.

    BACKLIGHT MODULE AND MANUFACTURING METHOD THEREOF
    2.
    发明公开
    BACKLIGHT MODULE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20240280855A1

    公开(公告)日：2024-08-22

    申请号：US18409797

    申请日：2024-01-11

    申请人： CARUX TECHNOLOGY PTE. LTD.

    发明人： Chao-Sen Yang ,  Chueh-Yuan Nien ,  Chao-Chin Sung ,  Chien-Tzu Chu

    IPC分类号： G02F1/13357 ,  G02F1/1335 ,  H01L33/62

    CPC分类号： G02F1/133603 ,  G02F1/133612 ,  H01L33/62 ,  H01L2933/0066

    摘要： A backlight module and a manufacturing method thereof are disclosed. The backlight module includes a substrate, a light emitting element, and a conductive layer. The substrate includes a central region and a peripheral region. The peripheral region surrounds the central region. The light emitting element is disposed in the central region. The conductive layer is disposed in the peripheral region and electrically connected to the light emitting element. The conductive layer has a first portion and a second portion. The first portion is closer to the light emitting element than the second portion. The first portion has a first metal layer area, and the second portion has a second metal layer area. The first metal layer area is greater than the second metal layer area. The backlight module and the manufacturing method thereof may reduce a loss of laser energy or improve a cutting yield during a cutting step of a manufacturing process.