公开(公告)号：US12027815B2

公开(公告)日：2024-07-02

申请号：US17223093

申请日：2021-04-06

Applicant: CIG Photonics Japan Limited

Inventor： Osamu Kagaya

IPC: H01S5/00 ,  G02F1/015 ,  H01P3/08

CPC classification number: H01S5/0085 ,  G02F1/0157 ,  H01P3/08

Abstract: Each semiconductor device includes a semiconductor laser unit and an optical modulator unit. Each transmission line is configured to transmit a drive signal to the optical modulator unit. Each resistor is provided for the transmission line and configured to terminate the drive signal. Each first conductive pattern is connected to one electrode of the semiconductor laser unit and one electrode of the optical modulator unit. Each chip capacitor has one electrode connected to another electrode of the semiconductor laser unit through a bonding wire. Each chip capacitor has another electrode connected to the first conductive pattern that is connected to the semiconductor laser unit. Each second conductive pattern is connected to the resistor, directly or through a DC blocking capacitor. Each third conductive pattern is connected to each of the first conductive pattern and the second conductive pattern through a conductive via hole in the chip carrier.

公开(公告)号：US11294129B2

公开(公告)日：2022-04-05

申请号：US17155133

申请日：2021-01-22

Applicant: CIG Photonics Japan Limited

Inventor： Osamu Kagaya

IPC: H04B10/00 ,  G02B6/42 ,  H01S5/042 ,  H01S5/02325 ,  H01S5/02212

Abstract: In an optical module, optical signal output having satisfactory waveform and intensity can be obtained. A differential transmission line includes a first differential transmission line, which has a first characteristic impedance and is connected to a drive IC, a second differential transmission line, which has a second characteristic impedance and is connected to a light output element, the second characteristic impedance being smaller than the first characteristic impedance, and connecting portions configured to connect the first differential transmission line and the second differential transmission line in series with each other. A resistive element is arranged between the connecting portions. The resistive element has a resistance value that is set to a value with which an absolute value of a reflection coefficient for a signal traveling from the second differential transmission line side to the first differential transmission line side is 0.10 or less.

公开(公告)号：US11792915B2

公开(公告)日：2023-10-17

申请号：US17589443

申请日：2022-01-31

Applicant: CIG Photonics Japan Limited

Inventor： Osamu Kagaya

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0218 ,  H05K1/115 ,  H05K2201/10121

Abstract: A printed circuit board includes: a conductor plate below the inner dielectric layer; some vias through the inner dielectric layer, bonded to the conductor plate, centered at respective points on an upper surface of the conductor plate; a ground conductor above the inner dielectric layer, bonded to the vias, extending outwardly from any quadrangle with vertices being the nearest four points of the points; an electromagnetic resonance plate above the inner dielectric layer and inside the quadrangle, electrically connected to the ground conductor and the vias with a portion other than a protruding outer edge serving as a junction; an upper dielectric layer above the electromagnetic resonance plate; and a differential transmission line pair composed of a pair of strip conductors overlapping with the electromagnetic resonance plate, above the upper dielectric layer. The conductor plate and the vias constitute an electromagnetic field confinement structure.