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公开(公告)号：US20230194906A1
公开(公告)日：2023-06-22
申请号：US16957309
申请日：2018-12-21
Applicant: Lumentum Technology UK Limited
Inventor： Selina FARWELL
CPC classification number: G02F1/0123 , G02F1/025 , G02F1/0156 , G02F1/0157
Abstract: A method of equalising optical losses, at a required operating wavelength, in waveguide sections in an optoelectronic device comprising a first semiconductor waveguide section and a second semiconductor waveguide section, the method comprising determining (1301) a first optical loss through the first waveguide section for a signal with the required operating wavelength, determining (1302) a second optical loss through the second waveguide section for the signal, determining (1303) a loss difference between the first optical loss and the second optical loss, determining (1304) a first bias voltage based on the loss difference and the operating wavelength, such that the loss difference is reduced, and applying (1305) the bias voltage to the first waveguide section.
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公开(公告)号：US11681167B2
公开(公告)日：2023-06-20
申请号：US17349835
申请日：2021-06-16
Applicant: ROCKLEY PHOTONICS LIMITED
Inventor： Abu Thomas , Albert Benzoni , Jacob Levy , Thomas Pierre Schrans , Andrea Trita , Guomin Yu , Aaron John Zilkie
IPC: G02F1/01 , G02F1/017 , H01S5/00 , H01S5/026 , H01S5/10 , G02F1/025 , G02B6/12 , H01S5/343 , H01S5/12 , H01S5/50 , H01S5/227 , G02F1/015
CPC classification number: G02F1/01708 , G02B6/12004 , G02F1/025 , H01S5/0085 , H01S5/026 , H01S5/0265 , H01S5/101 , G02F1/0157 , G02F2202/102 , G02F2203/70 , H01S5/12 , H01S5/227 , H01S5/34306 , H01S5/50
Abstract: A photonic chip. In some embodiments, the photonic chip includes a waveguide; and an optically active device comprising a portion of the waveguide. The waveguide may have a first end at a first edge of the photonic chip; and a second end, and the waveguide may have, everywhere between the first end and the second end, a rate of change of curvature having a magnitude not exceeding 2,000/mm2.
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公开(公告)号：US11681166B2
公开(公告)日：2023-06-20
申请号：US17082425
申请日：2020-10-28
Applicant: II-VI Delaware, Inc.
Inventor： David Adams , Andrei Kaikkonen , Nicolae Chitica
CPC classification number: G02F1/015 , H01S5/026 , H01S5/0601 , H01S5/124 , G02F1/0157 , G02F1/025 , G02F2202/102 , G02F2202/108 , H01S5/0265
Abstract: A wideband electro-absorption modulating (EAM) device is configured to include a ground shield that functions to minimize the spread of an applied AC voltage beyond the limits of the modulator's electrode. The ground shield includes a grounding electrode disposed in a spaced-apart relationship with the modulator electrode along the ridge of the EAM structure, and a grounding termination used to couple the grounding electrode to a suitable ground location. The ground location may be either on-chip (such as the DC ground of the modulator itself) or off-chip (via an off-chip capacitor, with a wirebond connecting the grounding electrode to the capacitor). The use of a ground shield mitigates the effects that changes in the data rate have on effective length of the modulator as seen by the applied data signal.
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公开(公告)号：US20240310660A1
公开(公告)日：2024-09-19
申请号：US18120719
申请日：2023-03-13
Applicant: Mellanox Technologies, Ltd.
Inventor： Oren STEINBERG , Moshe B. ORON , Isabelle CESTIER , Elad MENTOVICH , Timothy DE KEULENAER , Jochem VERBIST
CPC classification number: G02F1/0157 , G02F1/01708 , G02F2202/102 , G02F2202/108
Abstract: Systems and methods are described herein for an electro-absorption modulator (EAM) device. An example EAM device comprises an optical waveguide comprising a waveguide core configured to facilitate propagation of an optical signal therethrough; a segmented structure comprising diode segments disposed on the waveguide; and a differential electrical transmission line operatively coupled to the diode segments. The electrical transmission line includes a first transmission rail and a second transmission rail, and the electrical transmission line is configured to facilitate propagation of an electrical signal therethrough. The EAM device is configured for operation by a differential radio frequency (RF) source that is configured to supply the electrical signal to the EAM device, and the EAM device is formed on a semi-insulating substrate.
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公开(公告)号：US12027815B2
公开(公告)日：2024-07-02
申请号：US17223093
申请日：2021-04-06
Applicant: CIG Photonics Japan Limited
Inventor： Osamu Kagaya
CPC classification number: H01S5/0085 , G02F1/0157 , H01P3/08
Abstract: Each semiconductor device includes a semiconductor laser unit and an optical modulator unit. Each transmission line is configured to transmit a drive signal to the optical modulator unit. Each resistor is provided for the transmission line and configured to terminate the drive signal. Each first conductive pattern is connected to one electrode of the semiconductor laser unit and one electrode of the optical modulator unit. Each chip capacitor has one electrode connected to another electrode of the semiconductor laser unit through a bonding wire. Each chip capacitor has another electrode connected to the first conductive pattern that is connected to the semiconductor laser unit. Each second conductive pattern is connected to the resistor, directly or through a DC blocking capacitor. Each third conductive pattern is connected to each of the first conductive pattern and the second conductive pattern through a conductive via hole in the chip carrier.
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Patent Agency Ranking
6.发明公开公开(公告)号：US20240176172A1
公开(公告)日：2024-05-30
申请号：US18434059
申请日：2024-02-06
Applicant: II-VI Delaware, Inc.
Inventor： Andrei Kaikkonen , David Adams , Robert Lewen , Nicolae Chitica
CPC classification number: G02F1/025 , H01S5/0601 , G02F1/0157 , G02F2202/101 , G02F2202/102 , G02F2202/108
Abstract: An electro-absorption modulator (EAM) is configured to include an on-chip AC ground plane that is used to terminate the high frequency RF input signal within the chip itself. This on-chip ground termination of the modulation input signal improves the frequency response of the EAM, which is an important feature when the EAM needs to support data rates in excess of 50 Gbd. By virtue of using an on-chip ground for the very high frequency signal content, it is possible to use less expensive off-chip components to address the lower frequency range of the data signal (i.e., for frequencies less than about 1 GHz).
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公开(公告)号：US20240145328A1
公开(公告)日：2024-05-02
申请号：US18123170
申请日：2023-03-17
Applicant: Celestial AI Inc.
Inventor： Subal Sahni
CPC classification number: H01L23/34 , G02F1/0157 , H01L25/167
Abstract: The present disclosure relates to thermal control systems, photonic memory fabrics, and electro-absorption modulators (EAMs). For example, the thermal control systems efficiently move data in a memory fabric based on utilizing and controlling thermally controlling optical components. As another example, the EAMs are instances of optical modulators used to efficiently move data within digital circuits while maintaining thermally-stable optical modulation across a wide temperature range.
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公开(公告)号：US12130485B1
公开(公告)日：2024-10-29
申请号：US18610431
申请日：2024-03-20
Applicant: Celestial AI Inc.
Inventor： Philip Winterbottom , David Lazovsky , Ankur Aggarwal , Martinus Bos , Subal Sahni
CPC classification number: G02B6/4295 , G02B6/4246 , G02B6/428 , G02F1/0157 , G02B6/4245
Abstract: An implementation provides a package that includes a first die including a bridging element, an analog/mixed-signal (AMS) die, and a general die. The first die includes: a first photonic transceiver portion, a first die first interconnect region, and an optical interface (OI). The AMS die includes a second photonic transceiver portion, an AMS die first interconnect region on a first surface of the AMS die electrically and physically coupled with the first die first interconnect region; and an AMS die second interconnect region on a second surface of the AMS die. The general die includes a third photonic transceiver portion, and a general die first interconnect region electrically and physically coupled with the second photonic transceiver portion.
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公开(公告)号：US20240310688A1
公开(公告)日：2024-09-19
申请号：US18120894
申请日：2023-03-13
Applicant: Ciena Corporation
Inventor： Alexandre Delisle-Simard , Gregory Brookes , Michael Vitic
CPC classification number: G02F1/2255 , G02F1/0157 , G02F1/017 , G02F1/0316 , G02F1/0508 , G02F1/0553 , G02F1/212 , G02F1/2257 , G02F2202/20 , G02F2203/50
Abstract: An optical modulator includes an optical waveguide extending a length; and a plurality of Radio Frequency (RF) electrodes configured to modulate an optical signal in the optical waveguide, wherein the RF electrodes include an RF crossing located an end of the length and that is configured to equalize the optical signal. The optical signal is equalized via destructive interference after the RF crossing for attenuating modulation amplitude. At or near the end of the length, high frequencies of the optical signal are already strongly attenuated whereas low frequencies of the optical signal are not such that the low frequencies are equalized after the RF crossing.
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公开(公告)号：US20240272393A1
公开(公告)日：2024-08-15
申请号：US18632658
申请日：2024-04-11
Applicant: Celestial AI Inc.
Inventor： Philip WINTERBOTTOM , David Lazovsky , Ankur Aggarwal , Martinus Bos , Subal Sahni
CPC classification number: G02B6/4295 , G02B6/4246 , G02B6/428 , G02F1/0157 , G02B6/4245
Abstract: A package includes a first die with a compute element and first region, a second die with a compute element and second region, and a bridging element connecting the first and second dies. The bridging element includes interconnect regions for electrical coupling, a first photonic path from the first interconnect region to the second, and a second photonic path in the reverse direction. A photonic transceiver is integrated into the bridging element, with one portion sending and receiving optical signals via the photonic paths, and the other portion located in an AMS block in the first die or second die near the memory and compute elements. The transceiver portions are connected by a short electrical interconnect (less than 2 mm).
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